UWD1H4R7MCL1GS

The UWD1H4R7MCL1GS from Nichicon is a chip-type aluminum electrolytic capacitor engineered for surface-mount assemblies. It delivers 4.7 µF at 50 V in a compact φ5 × 5.8 mm SMD can designed for high-density PCBs and automated placement.

Built for high-temperature reflow processes and long-term operation up to 105°C, this low-impedance capacitor targets applications requiring reliable performance under elevated temperature and assembly stress, with AEC-Q200 qualification and RoHS compliance.

Key Features

• Capacitance & Voltage — 4.7 µF rated capacitance with ±20% tolerance and a 50 V rated voltage for mid-voltage decoupling and smoothing tasks.
• Low Impedance Performance — Designed as a low-impedance component; specified impedance of 1.52 Ω and tanδ of 0.12 at 20°C, 120 Hz, enabling improved ripple handling and stable AC performance.
• Ripple Current Handling — Defined ripple specifications of 42.5 mA at 120 Hz (low frequency) and 85 mA at 10 kHz (high frequency) for predictable dissipation in power applications.
• Thermal & Endurance — Operating temperature range from −55°C to +105°C with rated endurance of 2000 hours at 105°C, supporting sustained high-temperature operation.
• High-Temperature Reflow Compatibility — Chip-type construction qualified for 260°C peak reflow (recommended: 260°C peak for 5 seconds; 230°C over 60 seconds), suitable for modern reflow assembly processes.
• Surface-Mount Package & Assembly — φ5 × 5.8 mm SMD radial can with embossed carrier taping; designed for automatic mounting machines and compact PCB land pattern (5.3 × 5.3 mm).
• Reliability & Compliance — AEC-Q200 qualified and RoHS compliant; leakage current specified at 3 µA and stability/shelf-life characteristics defined per datasheet.

Typical Applications

• Automotive electronics — AEC-Q200 qualification and 105°C endurance make this capacitor suitable for automotive electronic modules that require robust SMD components.
• High-density PCB assemblies — Compact φ5 × 5.8 mm can and SMD land size support space-constrained designs on densely populated boards.
• Automated assembly lines — Embossed carrier taping and chip-type construction are intended for reliable feed and placement in automated pick-and-place processes and high-temperature reflow flows.

Unique Advantages

• Reflow-ready at 260°C: Supports peak 260°C reflow conditions for modern assembly processes, reducing assembly constraints for lead-free manufacturing.
• Compact SMD can: φ5 × 5.8 mm package minimizes board area while providing electrolytic capacitance density for decoupling and smoothing.
• Defined long-term endurance: 2000 hours at 105°C ensures predictable aging and performance for higher-temperature deployments.
• Low-loss electrical behavior: Specified tanδ and low impedance contribute to stable AC performance and controlled ESR-related effects in power circuits.
• Automated assembly compatible: Embossed carrier taping and machine-friendly package reduce BOM handling and streamline high-volume production.
• Established qualification and compliance: AEC-Q200 qualification plus RoHS compliance support use in regulated and reliability-focused designs.

Why Choose UWD1H4R7MCL1GS?

The UWD1H4R7MCL1GS pairs compact SMD packaging with low-impedance aluminum electrolytic performance and defined high-temperature endurance, making it a practical choice for designs that require electrolytic capacitance in confined board space and demanding thermal environments. Its 50 V rating, measured ripple current values, and AEC-Q200 qualification align with requirements for robust, automotive-grade and industrial electronic modules.

Engineers specifying this part benefit from a component designed for automated assembly and high-temperature reflow, predictable electrical characteristics (impedance, tanδ, leakage), and long-term stability backed by Nichicon’s UWD series specifications.

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