UWD1H560MCL1GS

The UWD1H560MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor engineered for surface-mount assembly. It delivers 56 µF capacitance at a 50 V rating in a compact φ8 × 10 mm can-style SMD package.

Designed for high-temperature reflow processes and long-term operation, this AEC-Q200‑rated device targets automotive and other high-reliability electronics where compact size, robust endurance and automated assembly compatibility are required.

Key Features

• Capacitance & Voltage — 56 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance for predictable energy storage and decoupling.
• Low Impedance & Ripple Handling — Rated impedance of 340 mΩ with low-frequency ripple current 150 mA (120 Hz) and high-frequency ripple current 300 mA (10 kHz) for effective smoothing in power circuits.
• High-Temperature Reflow Compatibility — Supports 260°C peak reflow soldering (recommended peak 260°C, 5 s) for compatibility with modern Pb‑free assembly processes.
• Automotive Grade Reliability — AEC-Q200 qualified and specified for operation from −55°C to +105°C, meeting automotive-grade endurance expectations.
• Long Endurance — Rated for 5000 hours at 105°C, with capacitance and leakage specifications maintained after endurance testing.
• Compact Surface-Mount Package — φ8 × 10 mm radial can SMD with a suggested land pattern of 8.3 × 8.3 mm and embossed carrier tape packaging for automated placement.
• Leakage & Stability — Specified leakage current of 28 µA and performance stability across the −55°C to +105°C category temperature range.

Typical Applications

• Automotive Electronics — Suited for electronic control modules and systems that require AEC‑Q200 qualification and high-temperature reflow compatibility.
• High‑Density Surface‑Mount PCBs — Designed for surface mounting on compact, densely populated boards where space and automated assembly are constraints.
• Automated Assembly & Reflow Lines — Packaged in embossed carrier tape and rated for 260°C peak reflow to integrate smoothly into automated production workflows.

Unique Advantages

• Automotive-Qualified Reliability: AEC-Q200 listing supports use in designs that demand automotive-level qualification and traceable component standards.
• Reflow-Ready Construction: Explicit support for 260°C peak reflow enables Pb‑free soldering processes and reduces assembly risk on lead-free production lines.
• Compact, Automated-Assembly Friendly: φ8 × 10 mm SMD can with embossed carrier tape and a defined land footprint simplifies pick-and-place and placement validation.
• Long Life at Elevated Temperature: 5000-hour endurance at 105°C provides proven longevity for sustained thermal environments.
• Robust Ripple Performance: Combined low impedance (340 mΩ) and specified ripple current ratings (150 mA @120 Hz, 300 mA @10 kHz) support stable power filtering in demanding circuits.
• Wide Operating Temperature: −55°C to +105°C operating range supports deployment across a broad set of environmental conditions.

Why Choose UWD1H560MCL1GS?

The UWD1H560MCL1GS combines compact SMD packaging with AEC‑Q200 qualification, high-temperature reflow compatibility and proven endurance (5000 h at 105°C). Its low impedance and defined ripple ratings make it a practical choice where stable power filtering and automated assembly are priorities.

This part is suited to engineers and purchasers specifying capacitors for automotive and other high-reliability surface‑mount designs that require a balance of size, thermal durability and predictable electrical performance, backed by Nichicon’s component specification and manufacturing support.

If you would like pricing, lead-time information or a formal quote for UWD1H560MCL1GS, please request a quote or contact sales to discuss volume pricing and availability.