UWD1H680MCL1GS

The UWD1H680MCL1GS is a chip‑type aluminum electrolytic capacitor designed for surface mounting on high‑density PC boards. It delivers 68 µF at 50 V in a compact radial can SMD package optimized for automated assembly and high‑temperature reflow processes.

Engineered for reliable operation from −55 °C to +105 °C and qualified to AEC‑Q200, this part targets automotive and industrial electronics where compact decoupling and long endurance under elevated temperatures are required.

Key Features

• Capacitance & Voltage — 68 µF rated capacitance at 50 V for bulk decoupling and energy storage in compact power rails.
• Low Impedance — Specified impedance of 340 mΩ to support stable filtering and reduced voltage ripple in power supply applications.
• High‑Temperature Reflow Compatibility — Compatible with 260 °C peak reflow soldering (recommended: 260 °C peak 5 s; 230 °C over 60 s ×2 for most sizes) for modern Pb‑free assembly flows.
• Extended Temperature Range — Rated operation from −55 °C to +105 °C for robust performance across harsh thermal environments.
• AEC‑Q200 Qualified & RoHS Compliant — Meets AEC‑Q200 qualification and RoHS (2011/65/EU, (EU)2015/863) requirements for regulated markets.
• Long Endurance — 5000 hours at 105 °C rated lifetime for sustained reliability in elevated‑temperature applications.
• Ripple Current Capability — 150 mA at 120 Hz and 300 mA at 10 kHz to handle dynamic load conditions and switching noise.
• Surface‑Mount Package — Radial can SMD package (L: 1.0 cm × D: 0.8 cm) with recommended land pattern L: 8.3 mm × W: 8.3 mm, suitable for automatic tape‑feed placement.
• Polarized Design — Standard polarized aluminum electrolytic construction for DC decoupling and bulk energy storage.

Typical Applications

• Automotive electronics — Designed for automotive electronic modules that require AEC‑Q200 qualified capacitors for power filtering and energy buffering.
• High‑density SMD assemblies — Compact chip form factor and recommended land footprint support power rail decoupling in space‑constrained boards.
• Automated production environments — Compatible with carrier‑tape feeding and high‑temperature reflow processes used in automated surface‑mount assembly.

Unique Advantages

• Automotive‑grade reliability: AEC‑Q200 qualification provides documented endurance and performance characteristics for automotive and similarly demanding applications.
• Reflow process resilience: Rated for 260 °C peak reflow enables use with modern lead‑free soldering profiles without compromising capacitor characteristics.
• High thermal endurance: 5000‑hour lifetime at 105 °C supports long‑term stability in elevated‑temperature environments.
• Compact, assembly‑friendly package: Small radial can SMD with carrier‑tape compatibility simplifies BOM and supports high‑volume automated placement.
• Low impedance for cleaner power rails: 340 mΩ impedance and defined ripple current ratings help reduce voltage ripple and improve regulator stability.
• Regulatory compliance: RoHS conformity ensures the part meets environmental substance restrictions for global production.

Why Choose UWD1H680MCL1GS?

The UWD1H680MCL1GS combines a compact SMD aluminum electrolytic form factor with AEC‑Q200 qualification and high‑temperature reflow compatibility, delivering a practical solution for designers who need reliable bulk capacitance in space‑limited, automated assembly environments. Its specified impedance, ripple current ratings, and long endurance at 105 °C make it well suited to sustained power filtering and energy‑buffering roles in automotive and industrial electronic systems.

This part is a strong choice for engineering teams designing high‑density power rails where environmental compliance, robust soldering process compatibility, and proven lifetime performance are required.

If you need pricing, availability, or technical support for UWD1H680MCL1GS, request a quote or contact sales to discuss your application requirements and lead times.