UWD1H3R3MCL1GS

The UWD1H3R3MCL1GS is a chip‑type aluminum electrolytic capacitor designed for surface‑mount assembly. It provides 3.3 µF capacitance at 50 V in a compact φ4 × 5.8 mm SMD package and is optimized for applications that require low impedance, low leakage and high‑temperature reflow compatibility.

Targeted for automotive use and other demanding environments, this capacitor combines AEC‑Q200 qualification, a wide operating range of −55 °C to +105 °C, and a 2000‑hour endurance rating at 105 °C to support reliable performance in high‑density, automated production environments.

Key Features

• Capacitance & Voltage — 3.3 µF rated capacitance at 50 V for energy storage and decoupling in compact SMD form factor.
• Low Impedance — Specified impedance of 5 Ω and a tangent of loss angle (tan δ) of 0.12 measured at 20 °C, 120 Hz, supporting stable AC performance.
• Ripple & Leakage — Low frequency ripple current 15 mA (120 Hz), high frequency ripple current 30 mA (10 kHz) and leakage current specified at 3 µA.
• Temperature Range & Endurance — Rated for −55 °C to +105 °C with a specified lifetime of 2000 hours at 105 °C for the φ4 × 5.8 mm size.
• High‑Temperature Reflow Compatibility — Chip type designed to withstand 260 °C peak reflow soldering (recommended reflow condition: 260 °C peak, 5 s) to support modern assembly processes.
• Surface‑Mount Assembly Friendly — Embossed carrier taping packaging and a surface mount land size recommendation (4.3 × 4.3 mm) for automated pick‑and‑place on high‑density PCBs.
• Automotive Qualification — AEC‑Q200 rated for applications requiring qualification to automotive stress and reliability standards.
• Regulatory Compliance — RoHS compliant construction for regulated environmental requirements.

Typical Applications

• Automotive electronic modules — Bulk decoupling and smoothing in control units where AEC‑Q200 qualification and operation from −55 °C to +105 °C are required.
• Power supply circuits — Local energy storage and ripple suppression in compact 50 V systems on high‑density PCBs.
• High‑density SMD assemblies — Surface‑mount boards assembled with automated carrier tape pick‑and‑place and exposed to high‑temperature reflow profiles.

Unique Advantages

• Compact SMD footprint: φ4 × 5.8 mm package with recommended land size 4.3 × 4.3 mm enables use on space‑constrained PCBs.
• Reflow‑ready for modern assembly: Designed to withstand 260 °C peak reflow, simplifying integration into standard lead‑free assembly flows.
• Automotive‑grade reliability: AEC‑Q200 qualification and 2000 hours endurance at 105 °C support deployment in automotive and other high‑reliability systems.
• Measured electrical stability: Low impedance (5 Ω), controlled tan δ (0.12 at 20 °C, 120 Hz), and low leakage (3 µA) provide predictable performance for design validation.
• Assembly efficiency: Embossed carrier taping and automatic mounting compatibility reduce handling and assembly time in volume production.
• Regulatory readiness: RoHS compliance supports use in regulated product lines without additional materials qualification.

Why Choose UWD1H3R3MCL1GS?

The UWD1H3R3MCL1GS is positioned for engineers who need a compact, surface‑mount aluminum electrolytic capacitor that combines 50 V rating, low impedance, low leakage and AEC‑Q200 qualification. Its tolerance, measured loss characteristics, and ripple current figures make it suitable for reliable decoupling and smoothing in automotive and other demanding electronic modules.

With RoHS compliance, embossed carrier taping for automated placement, and compatibility with 260 °C peak reflow, this capacitor supports efficient production workflows while meeting temperature and endurance requirements for long‑term operation at up to 105 °C.

To request a quote or discuss volume pricing and availability for UWD1H3R3MCL1GS, please contact sales or submit a quote request with your project details.