UWD1H2R2MCL1GS

The UWD1H2R2MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount, high-density PC board assemblies. It features low impedance performance, a 2.2 µF capacitance at 50 V rating, and is built to withstand high-temperature reflow processes up to a 260°C peak.

Engineered for demanding environments, this capacitor is AEC-Q200 qualified, RoHS compliant, and specified for operation from −55°C to +105°C, making it suitable for automotive electronics and other applications requiring robust thermal and mechanical compatibility with automated SMT assembly.

Key Features

• Capacitance & Voltage — 2.2 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance, suitable for decoupling and filtering in power circuits.
• Low Impedance — Specified impedance of 5 Ω, supporting efficient ripple handling and stable performance across the intended operating conditions.
• High-Temperature Reflow Compatibility — Designed for 260°C peak reflow soldering; recommended reflow condition: 260°C peak for 5 seconds (with extended 230°C profiles as specified), enabling lead-free assembly processes.
• Automotive-Grade Reliability — AEC-Q200 qualified and rated for operation from −55°C to +105°C with a lifetime of 2,000 hours at 105°C (endurance specification), supporting long-term stability in harsh environments.
• Surface-Mount, Tape-Feed Friendly — Chip-type SMD can package optimized for automatic mounting machines and high-density PCBs; recommended land size L: 4.3 × W: 4.3 mm for layout.
• Regulatory Compliance — Compliant with RoHS directives (2011/65/EU, (EU)2015/863), suitable for designs subject to these requirements.
• Package and Form Factor — Compact dimensions: L: 5.8 × D: 4 mm with a seated height of up to 5.8 mm, enabling tight board-space implementations.
• Ripple Current Capability — Specified ripple handling of 15 mA at 120 Hz and 30 mA at 10 kHz for AC conditions encountered in power-supply filtering.

Typical Applications

• Automotive electronic control units (ECUs) — Decoupling and filtering in power rails where AEC-Q200 qualification and operation to +105°C are required.
• Power supply filtering on high-density PCBs — Surface-mount can package and compact footprint make it suitable for localized bulk/decoupling capacitors near regulators and converters.
• Sensor and actuator electronics — Low impedance and specified ripple current support stable supply filtering for analog front-ends and actuator drive circuits.
• Telematics and infotainment modules — RoHS compliance and SMT compatibility support automated assembly of modules that require robust thermal processing.

Unique Advantages

• Reflow-ready for lead-free assembly: Specified for 260°C peak reflow soldering (recommended profile included), enabling modern SMT workflows.
• Automotive-grade qualification: AEC-Q200 qualification provides a documented reliability baseline for automotive designs and similar demanding applications.
• Compact SMD can package: Small footprint (5.8 × 4 mm) and tape-feed compatibility simplify placement on high-density boards and automated assembly lines.
• High-temperature endurance: Rated for 2,000 hours at 105°C, supporting long-term operation in elevated-temperature environments.
• Low-impedance performance: 5 Ω impedance and specified ripple current values help maintain power stability and reduce voltage ripple in supply circuits.
• Regulatory compliance: RoHS compliant for designs subject to European restricted substances requirements.

Why Choose UWD1H2R2MCL1GS?

UWD1H2R2MCL1GS combines a compact chip-type SMD can package with low impedance, AEC-Q200 qualification, and high-temperature reflow compatibility, making it a practical choice for engineers designing reliable power filtering into space-constrained, thermally demanding assemblies. Its specification set—2.2 µF at 50 V, operation from −55°C to +105°C, and endurance at elevated temperature—aligns with the needs of automotive and industrial applications that require documented reliability and automated assembly readiness.

The part is well suited to designs where board space, automated SMT processing, and long-term thermal endurance are priorities, offering a verifiable component choice for procurement and engineering teams focused on robustness and manufacturability.

If you would like pricing, availability, or technical support for UWD1H2R2MCL1GS, request a quote or submit an inquiry to our sales team and include your required quantities and project timeline.