UWD1H330MCL1GS

The UWD1H330MCL1GS is a surface-mount aluminum electrolytic capacitor in a compact chip-style can designed for high-density PCB assemblies. It delivers 33 µF capacitance at a 50 V rating with low impedance characteristics and is optimized for applications requiring elevated temperature operation and reflow assembly.

Targeted for automotive and industrial power electronics, the part combines AEC‑Q200 qualification, a wide operating temperature range, and reflow compatibility to support reliable decoupling and bulk energy storage on automated production lines.

Key Features

• Capacitance & tolerance — 33 µF nominal with ±20% tolerance (–20%~20%) at 120 Hz, 20°C, providing defined charge storage for power rail stabilization.
• Rated voltage — 50 V working voltage suited for mid-voltage power rails and DC link applications.
• Low impedance — Rated impedance 680 mΩ, supporting lower ripple and improved transient response in power circuits.
• Loss characteristics — tanδ 0.12 (measured at 20°C, 120 Hz, 50 V) to characterize ESR-related losses for thermal and filtering considerations.
• Ripple current capability — Low-frequency ripple current 92.5 mA (120 Hz) and high-frequency ripple current 185 mA (10 kHz) for AC stress ratings in switching and rectifier circuits.
• Leakage current — Specified leakage current 16.5 µA, suitable for designs with low standby current requirements.
• High-temperature endurance — Rated for operation from –55°C to +105°C with a lifetime/endurance of 2000 hours at 105°C for the φ6.3 case size.
• Reflow-compatible assembly — Chip-type construction compatible with 260°C peak reflow (recommended condition: 260°C peak 5 s; 230°C over 60 s), and designed for automatic mounting by carrier tape.
• Compact SMD package — Case dimensions φ6.3 × 7.7 mm (L × D) with recommended land size 6.6 × 6.6 mm, enabling use on space-constrained boards.
• Quality & compliance — AEC‑Q200 qualified and RoHS compliant, and available in embossed carrier taping for automated assembly; mass production status.

Typical Applications

• Automotive power modules — Decoupling and bulk capacitance for ECUs and power distribution modules where AEC‑Q200 qualification and high-temperature endurance are required.
• High-density PCB power filtering — Surface-mount chip form factor and compact footprint make it suitable for decoupling on compact power boards and modules.
• Switch-mode power supplies — Supports ripple and transient filtering in DC‑DC converters and regulator outputs with specified low-frequency and high-frequency ripple current ratings.
• Reflow-assembled systems — Designed for automated placement and reflow processes, supporting boards that require 260°C peak reflow compatibility.

Unique Advantages

• AEC‑Q200 qualification: Provides confidence for designs targeting automotive and demanding mobile environments where component qualification matters.
• Wide temperature range: –55°C to +105°C operation and a 2000-hour endurance rating at 105°C support sustained performance in elevated-temperature applications.
• Reflow-ready SMD form: Chip-style can and embossed carrier taping enable automated SMT assembly and efficient board-level integration.
• Compact footprint: φ6.3 × 7.7 mm size and small recommended land pattern allow dense placement on space-constrained boards.
• Measured ripple and impedance specs: Explicit low-/high-frequency ripple current and 680 mΩ impedance data help engineers predict thermal and filtering performance in their systems.
• Regulatory compliance: RoHS compliance supports use in regulated production environments.

Why Choose UWD1H330MCL1GS?

UWD1H330MCL1GS is positioned for designs that require a compact, reflow-compatible aluminum electrolytic capacitor with verifiable electrical and environmental performance. Its combination of 33 µF capacitance at 50 V, low impedance, defined ripple current ratings, and AEC‑Q200 qualification make it well suited to automotive and industrial power electronics where temperature endurance and automated assembly are priorities.

Engineers specifying this part can rely on explicit datasheet parameters—impedance, tanδ, leakage current, ripple ratings, size, and endurance—to size and validate filtering and energy-storage functions while maintaining a small board footprint and production-ready packaging.

To request a quote or discuss volume pricing and availability for UWD1H330MCL1GS, please contact sales or submit a quotation request through your preferred procurement channel.