UWD1V151MCL1GS

The UWD1V151MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density PCBs. It provides 150 µF at 35 V with low impedance and is intended for high-reliability applications, including automotive electronics where AEC‑Q200 qualification and wide temperature operation are required.

Engineered for modern production, the device supports 260°C peak reflow soldering and automatic assembly with carrier tape, offering a combination of robust electrical performance, elevated operating temperature capability, and manufacturing compatibility.

Key Features

• Chip SMD Form Factor Designed as a chip-type aluminum electrolytic for surface mounting on high-density printed circuit boards and compatible with automatic mounting machines fed with carrier tape.
• High-Temperature Reflow Compatibility Corresponds with 260°C peak reflow soldering. Recommended reflow condition: 260°C peak for 5 seconds; 230°C over 60 seconds, repeat 2 times (φ10 × 10: 1 time).
• Electrical Performance 150 µF rated capacitance at 35 V with nominal impedance of 170 mΩ and capacitance tolerance of ±20%.
• Frequency and Ripple Characteristics Specified ripple current 225 mA at 120 Hz (low frequency) and 450 mA at 10 kHz (high frequency).
• Wide Operating Temperature & Endurance Rated for −55°C to +105°C operation with a published lifetime of 5000 hours at 105°C.
• Package and Land Pattern Radial can SMD package with footprint guidance: surface mount land size 8.3 × 8.3 mm and overall dimensions L: 1.0 cm × D: 0.8 cm.
• Industry Compliance RoHS compliant and AEC‑Q200 qualified for applications requiring recognized component-level reliability standards.

Typical Applications

• Automotive Electronics Suitable for automotive control modules and systems that require AEC‑Q200 qualification and operation across −55°C to +105°C.
• High-Density Surface-Mount Designs Intended for power decoupling and bulk storage on compact, high-density PCBs due to its chip SMD form factor.
• Automated Assembly Lines Designed for compatibility with automatic mounting equipment and carrier-tape feeding for high-throughput manufacturing.

Unique Advantages

• Reflow-ready for modern assembly: Supports 260°C peak reflow soldering to integrate into standard high-temperature SMT processes.
• Qualification for demanding environments: AEC‑Q200 qualification and −55°C to +105°C operating range provide confidence in temperature- and vibration-prone applications.
• Low impedance, defined ripple handling: 170 mΩ impedance with specified ripple currents for reliable power smoothing at both low and high frequencies.
• Long-term thermal endurance: Rated for 5000 hours at 105°C, offering predictable life performance in sustained elevated-temperature conditions.
• Production-friendly packaging: Chip SMD form and carrier-tape compatibility simplify pick-and-place and automated assembly integration.
• Regulatory compliance: RoHS compliance supports use in products requiring restricted-substance conformity.

Why Choose UWD1V151MCL1GS?

The UWD1V151MCL1GS delivers a balanced combination of capacitance, voltage rating, low impedance, and thermal endurance in a compact SMD aluminum electrolytic package. Its AEC‑Q200 qualification, RoHS compliance, and support for 260°C peak reflow make it well suited to engineered designs that require automotive-grade reliability and manufacturing compatibility.

Choose this part when your design demands robust power decoupling or bulk energy storage on high-density PCBs with automated assembly and defined ripple and lifetime specifications.

If you need pricing, availability, or a formal quote for UWD1V151MCL1GS, request a quote or submit an inquiry to our sales team for prompt assistance and lead-time information.