UWD1V330MCL1GS
| Part Description |
33 µF 35 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 642 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 33 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 6.1 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 440 mOhm | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 230 mA @ 10 kHz | Ripple Current Low Frequency | 115 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.8 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 35 V |
Overview of UWD1V330MCL1GS – 35 V, 33 µF Chip Aluminum Electrolytic Capacitor
The UWD1V330MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon’s UWD series, specified for surface-mount assembly on high-density PC boards. It combines 33 µF capacitance at 35 V with low impedance characteristics and is designed to withstand elevated operating temperatures up to +105°C.
Engineered for automated SMD production, the part supports carrier-tape mounting and reflow soldering profiles up to a 260°C peak. It is RoHS compliant and AEC-Q200 qualified for applications requiring recognized component-level reliability.
Key Features
- Electrical performance — 33 µF nominal capacitance at 35 V with ±20% tolerance and polarization appropriate for typical DC filtering and decoupling duties.
- Low impedance — Characteristic impedance specified at 440 mOhm, with ripple current ratings of 115 mA at 120 Hz and 230 mA at 10 kHz for effective ripple suppression.
- High-temperature operation — Rated for operation from −55°C to +105°C with endurance defined as 2000 hours at 105°C for this size (φD = 6.3 mm).
- Reflow and assembly compatibility — Chip-type package designed for automatic mounting by carrier tape and compatible with 260°C peak reflow (recommended: 260°C peak for 5 seconds; 230°C over 60 seconds as noted).
- Compact SMD can package — Size dimensions L: 5.8 × D: 6.3 mm with recommended land pattern 6.6 × 6.6 mm, enabling dense board layouts.
- Leakage and loss characteristics — Leakage current limited to ≤0.01 CV or 3 µA (whichever is greater) after 2 minutes at 20°C; tan δ specified for 35 V at 120 Hz (max. 0.12) for predictable AC behavior.
- Compliance and qualification — RoHS compliant and AEC-Q200 qualified for designs requiring standardized component qualification.
Typical Applications
- Automotive electronics — Smoothing and decoupling in ECUs, power modules and other vehicle electronics where AEC-Q200 qualification and +105°C operation are required.
- Power supply filtering — Bulk and output filtering for DC-DC converters and voltage regulators on compact SMD boards.
- High-density SMD assemblies — On-board decoupling in space-constrained designs that require carrier-tape compatible, reflow-capable capacitors.
- Industrial control modules — Power conditioning and ripple suppression in industrial electronics operating across a wide temperature range.
Unique Advantages
- Designed for elevated-temperature use — Rated to +105°C with defined endurance (2000 hours at 105°C for this diameter), providing predictable lifetime behavior under thermal stress.
- Reflow-capable for modern assembly — Specified for 260°C peak reflow conditions, simplifying integration into lead‑free SMT production flows.
- Low-impedance performance — 440 mOhm impedance and defined ripple current ratings deliver effective noise and ripple suppression in power circuits.
- AEC-Q200 qualification — Meets industry qualification for applications that require verified component-level reliability.
- Compact SMD form factor — Small L × D footprint and recommended land size support high-density PCB layouts while remaining compatible with automated pick-and-place.
Why Choose UWD1V330MCL1GS?
The UWD1V330MCL1GS targets designers who need a compact, low-impedance aluminum electrolytic capacitor that is compatible with modern SMT assembly and elevated operating temperatures. With 33 µF at 35 V, defined ripple current capability, and endurance validated at 105°C, it provides a verifiable component choice for power filtering and decoupling on dense PCBs.
Its combination of reflow compatibility, RoHS compliance, and AEC-Q200 qualification makes it suitable for demanding applications where manufacturability and component-level reliability are important considerations.
Request a quote or contact sales to discuss availability, lead times, and how UWD1V330MCL1GS can fit into your next design.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016