UWD1V330MCL1GS

CAP ALUM 33UF ±20% 35V SMD
Part Description

33 µF 35 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 642 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUWD
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance33 µFECCNEAR99
ESRN/AHeight Seated (Max)6.1 mmHTS Code8532.22.0020
Impedance440 mOhmLead SpacingN/ALifetime @ Temp2000 h @ 105°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 105°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency230 mA @ 10 kHzRipple Current Low Frequency115 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension5.8 x 6.3 mmSurface Mount Land Size6.6 x 6.6 mm
Tolerance-20%~20%Voltage35 V

Overview of UWD1V330MCL1GS – 35 V, 33 µF Chip Aluminum Electrolytic Capacitor

The UWD1V330MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon’s UWD series, specified for surface-mount assembly on high-density PC boards. It combines 33 µF capacitance at 35 V with low impedance characteristics and is designed to withstand elevated operating temperatures up to +105°C.

Engineered for automated SMD production, the part supports carrier-tape mounting and reflow soldering profiles up to a 260°C peak. It is RoHS compliant and AEC-Q200 qualified for applications requiring recognized component-level reliability.

Key Features

  • Electrical performance — 33 µF nominal capacitance at 35 V with ±20% tolerance and polarization appropriate for typical DC filtering and decoupling duties.
  • Low impedance — Characteristic impedance specified at 440 mOhm, with ripple current ratings of 115 mA at 120 Hz and 230 mA at 10 kHz for effective ripple suppression.
  • High-temperature operation — Rated for operation from −55°C to +105°C with endurance defined as 2000 hours at 105°C for this size (φD = 6.3 mm).
  • Reflow and assembly compatibility — Chip-type package designed for automatic mounting by carrier tape and compatible with 260°C peak reflow (recommended: 260°C peak for 5 seconds; 230°C over 60 seconds as noted).
  • Compact SMD can package — Size dimensions L: 5.8 × D: 6.3 mm with recommended land pattern 6.6 × 6.6 mm, enabling dense board layouts.
  • Leakage and loss characteristics — Leakage current limited to ≤0.01 CV or 3 µA (whichever is greater) after 2 minutes at 20°C; tan δ specified for 35 V at 120 Hz (max. 0.12) for predictable AC behavior.
  • Compliance and qualification — RoHS compliant and AEC-Q200 qualified for designs requiring standardized component qualification.

Typical Applications

  • Automotive electronics — Smoothing and decoupling in ECUs, power modules and other vehicle electronics where AEC-Q200 qualification and +105°C operation are required.
  • Power supply filtering — Bulk and output filtering for DC-DC converters and voltage regulators on compact SMD boards.
  • High-density SMD assemblies — On-board decoupling in space-constrained designs that require carrier-tape compatible, reflow-capable capacitors.
  • Industrial control modules — Power conditioning and ripple suppression in industrial electronics operating across a wide temperature range.

Unique Advantages

  • Designed for elevated-temperature use — Rated to +105°C with defined endurance (2000 hours at 105°C for this diameter), providing predictable lifetime behavior under thermal stress.
  • Reflow-capable for modern assembly — Specified for 260°C peak reflow conditions, simplifying integration into lead‑free SMT production flows.
  • Low-impedance performance — 440 mOhm impedance and defined ripple current ratings deliver effective noise and ripple suppression in power circuits.
  • AEC-Q200 qualification — Meets industry qualification for applications that require verified component-level reliability.
  • Compact SMD form factor — Small L × D footprint and recommended land size support high-density PCB layouts while remaining compatible with automated pick-and-place.

Why Choose UWD1V330MCL1GS?

The UWD1V330MCL1GS targets designers who need a compact, low-impedance aluminum electrolytic capacitor that is compatible with modern SMT assembly and elevated operating temperatures. With 33 µF at 35 V, defined ripple current capability, and endurance validated at 105°C, it provides a verifiable component choice for power filtering and decoupling on dense PCBs.

Its combination of reflow compatibility, RoHS compliance, and AEC-Q200 qualification makes it suitable for demanding applications where manufacturability and component-level reliability are important considerations.

Request a quote or contact sales to discuss availability, lead times, and how UWD1V330MCL1GS can fit into your next design.

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