UWD1V270MCL1GS

The UWD1V270MCL1GS is a surface-mount aluminum electrolytic capacitor from Nichicon's UWD series, offering 27 µF capacitance at a 35 V rating in a compact φ6.3×5.8 mm can-style SMD package. It is designed for high-density PCB assembly and automated placement, with specifications aimed at reliability in demanding thermal and electrical environments.

Key value propositions include AEC-Q200 qualification, compatibility with high-temperature reflow processes, and defined performance across a wide temperature range (−55°C to 105°C), making it suitable for automotive and industrial electronics where board space, thermal endurance and predictable ripple handling are important.

Key Features

• Capacitance & Voltage — 27 µF nominal capacitance rated at 35 V with capacitance tolerance −20% to +20% (±20% at 120 Hz, 20°C).
• Low-impedance performance — Specified impedance of 440 mΩ and tan δ of 0.12 (measured at 20°C, 120 Hz) for stable AC behavior in filter and decoupling roles.
• Defined ripple handling — Low-frequency ripple current 115 mA (120 Hz) and high-frequency ripple current 230 mA (10 kHz) to support power rail smoothing and transient loads.
• Thermal and endurance ratings — Operating temperature −55°C to 105°C with rated endurance of 2000 hours at 105°C (for φD = 6.3), giving predictable life characteristics at elevated temperature.
• Reflow compatibility — UWD series is compatible with 260°C peak reflow soldering; recommended reflow condition: 260°C peak for 5 s and 230°C over 60 s.
• SMD packaging & assembly — Radial can SMD package (φ6.3×5.8 mm) supplied in embossed carrier taping for automated placement; recommended land pattern 6.6×6.6 mm.
• Compliance & qualification — RoHS compliant and AEC-Q200 qualified (series-level qualification noted in datasheet).

Typical Applications

• Automotive electronics — For board-level decoupling and power filtering where AEC-Q200 qualification and defined thermal endurance are required.
• High-density PCB designs — Compact φ6.3×5.8 mm SMD can suited to space-constrained power rails and compact power modules.
• Automated SMT production — Packaged in embossed carrier tape and compatible with machine placement and high-temperature reflow processes for reliable assembly.

Unique Advantages

• Compact SMD can — φ6.3×5.8 mm package offers a small footprint while maintaining 27 µF capacitance, helping reduce board area for power components.
• Predictable ripple capability — Specified low- and high-frequency ripple current ratings (115 mA at 120 Hz, 230 mA at 10 kHz) provide clear criteria for power-filter and regulator design.
• Thermal endurance — Rated for 2000 hours at 105°C (for this case diameter), enabling designers to dimension for elevated operating temperatures with known longevity.
• Manufacturing-ready — Compatibility with 260°C peak reflow and embossed carrier taping supports high-throughput SMT assembly and modern reflow profiles.
• Qualification and compliance — AEC-Q200 qualification (series) and RoHS compliance support regulated environments and industry-standard reliability expectations.

Why Choose UWD1V270MCL1GS?

The UWD1V270MCL1GS delivers a balanced combination of compact size, defined electrical performance and thermal robustness tailored to demanding board-level power designs. With explicit impedance, ripple, leakage and endurance specifications, engineers can design to measurable targets for filtering, decoupling and energy-storage tasks on compact PCBs.

This part is well-suited to designs that require automated SMT assembly, reflow compatibility up to 260°C peak, and qualification-level assurance through AEC-Q200 (series). Choose UWD1V270MCL1GS when you need a space-efficient electrolytic capacitor with documented ripple handling and thermal endurance for automotive and industrial electronics applications.

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