UWD1V331MCL1GS

The UWD1V331MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon’s UWD series, engineered for surface-mount, high-density PCB assemblies. It delivers 330 µF at 35 V in a compact φ10 × 10 mm can-style SMD package.

Designed for robust thermal and lifecycle performance, this part supports AEC-Q200 qualification and RoHS compliance, offers low impedance and high ripple current capability, and is compatible with high-temperature reflow assembly processes.

Key Features

• Electrical Performance — 330 µF capacitance at 35 V with ±20% tolerance and specified low impedance of 90 mΩ for effective smoothing and energy buffering.
• Loss Characteristics — tanδ measured at 20°C, 120 Hz; for 35 V ratings the maximum tanδ is 0.12, enabling predictable AC loss behavior.
• Ripple Current Capability — Low-frequency ripple current rated 335 mA at 120 Hz and high-frequency ripple current rated 670 mA at 10 kHz to support demanding power conditions.
• Leakage Current — Part-specific leakage current specified as 115.5 µA at rated conditions for predictable standby and bias performance.
• Thermal and Endurance — Operating range −55°C to +105°C with endurance specified as 5000 hours at 105°C.
• High-Temperature Reflow Compatibility — Corresponds with 260°C peak reflow soldering (recommended peak 260°C for 5 seconds; 230°C over 60 seconds), supporting lead‑free assembly processes.
• Package & Mounting — Chip type radial can in SMD format (φ10 × 10 mm) designed for automatic mounting with embossed carrier taping; surface mount land size 10.3 × 10.3 mm.
• Quality & Compliance — AEC-Q200 qualified and RoHS compliant; product status: mass production.

Typical Applications

• Automotive electronics — AEC-Q200 qualification and 105°C endurance make the UWD1V331MCL1GS suitable for vehicle electronic power filtering on high-density boards.
• High-density surface-mount power modules — Chip-type SMD construction and embossed carrier taping support automated placement in compact power assemblies.
• High-temperature industrial controls — Rated operation to 105°C with 5000-hour endurance provides reliability in elevated-temperature environments and long-life deployments.
• Lead-free assembly lines — Compatibility with 260°C peak reflow enables integration into modern lead‑free manufacturing processes.

Unique Advantages

• Low impedance profile: 90 mΩ impedance reduces voltage ripple and improves transient performance in power delivery networks.
• High ripple tolerance: Specified ripple currents at both 120 Hz and 10 kHz allow the capacitor to handle a range of switching and ripple conditions.
• Compact SMD form factor: φ10 × 10 mm chip-type package saves board space while enabling automated placement for high-density PCBs.
• High-temperature assembly ready: Validated for 260°C peak reflow to support lead-free manufacturing without compromising performance.
• Long-term reliability: 5000 hours endurance at 105°C supports prolonged field life in demanding thermal environments.
• Industry-grade qualification: AEC-Q200 rating and RoHS compliance provide traceable quality and regulatory alignment for regulated applications.

Why Choose UWD1V331MCL1GS?

The UWD1V331MCL1GS combines a robust electrical profile—330 µF at 35 V with low impedance and substantial ripple current ratings—with a chip-type SMD package engineered for high-temperature reflow and automated assembly. Its 5000-hour endurance at 105°C and AEC-Q200 qualification position it for applications where thermal durability and reliability matter.

This part is well suited to design teams building compact, surface-mounted power solutions for automotive and industrial markets who require predictable performance, compatibility with lead-free assembly, and production-ready availability from Nichicon’s UWD series.

Request a quote or submit an inquiry to our sales team to evaluate UWD1V331MCL1GS for your next design and to confirm availability and lead times.