UWD1V4R7MCL1GS

The UWD1V4R7MCL1GS from Nichicon is a chip-type aluminum electrolytic capacitor designed for surface-mount assembly on high-density printed circuit boards. It delivers 4.7 µF at 35 V in a compact SMD can package with low impedance characteristics and polarized construction.

Engineered for robust assembly and operation, this part supports high-temperature reflow processes and is qualified to AEC‑Q200 with RoHS compliance, making it suitable for demanding industrial and automotive electronic modules that require reliable decoupling and smoothing under elevated temperature conditions.

Key Features

• Electrical Performance — 4.7 µF capacitance at 35 V with ±20% tolerance and a specified impedance of 1.8 Ω; polarized design for DC power and decoupling applications.
• Ripple Current — Specified ripple handling of 40 mA at 120 Hz and 80 mA at 10 kHz for AC ripple and filtering use cases.
• Thermal & Reflow Compatibility — Compatible with 260°C peak reflow soldering; recommended reflow condition is 260°C peak for 5 seconds (with additional guidance of 230°C over 60 seconds as noted for process control).
• Operating Range — Rated for a category temperature range from −55°C to +105°C, supporting operation across broad thermal environments.
• Reliability & Lifetime — AEC‑Q200 qualified and RoHS compliant; lifetime specified as 2000 hours at 105°C for sustained high-temperature applications.
• Surface-Mount Packaging — Chip-type, SMD can package designed for automatic mounting using carrier tape and assembly on high-density PC boards.

Typical Applications

• Automotive electronic modules — AEC‑Q200 qualification and high-temperature operation make this capacitor suitable for control units and sensor electronics requiring reliable power decoupling.
• Power supply filtering — Used for output smoothing and local decoupling on DC/DC converters and power rails where low impedance and defined ripple capability are required.
• High-density surface-mount assemblies — Designed for placement on compact, densely populated PCBs and compatible with automated carrier-tape mounting.
• Industrial control electronics — Applicable where prolonged operation at elevated temperatures and robust soldering processes are part of the product lifecycle.

Unique Advantages

• High-temperature reflow compatibility: Rated for 260°C peak reflow, enabling reliable assembly with modern Pb‑free solder processes.
• AEC‑Q200 qualification: Provides a defined automotive-grade reliability baseline for designs targeting vehicle electronics.
• RoHS compliant: Meets regulatory requirements for restricted substances, simplifying compliance for end products.
• Designed for automated SMD assembly: Chip-type can package and carrier-tape compatibility streamline high-volume production.
• Specified lifetime at temperature: 2000 hours at 105°C gives a clear endurance expectation for elevated-temperature deployments.
• Clear electrical limits: Documented impedance, ripple currents, and leakage current spec enable predictable electrical design and simulation.

Why Choose UWD1V4R7MCL1GS?

The UWD1V4R7MCL1GS combines low-impedance aluminum electrolytic performance with high-temperature reflow compatibility and automotive-grade qualification, making it a practical choice for engineers designing compact, reliable power systems. Its polarized SMD can form factor and automated assembly compatibility support efficient production of high-density electronic assemblies.

This part is well suited to designers seeking a verified, RoHS-compliant electrolytic solution with specified ripple handling and a defined lifetime at elevated temperatures—particularly for automotive and industrial applications where AEC‑Q200 qualification and high-temperature soldering processes are required.

If you would like pricing or availability for UWD1V4R7MCL1GS, please request a quote or contact sales to submit your requirements and receive assistance.