UWF0J151MCL1GS
| Part Description |
150 µF 6.3 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,002 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWF |
| Manufacturer | Nichicon |
| Manufacturing Status | End Of Life |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 150 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 6.2 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 800 mOhm | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 150 mA @ 10 kHz | Ripple Current Low Frequency | 75 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 6.2 x 8 mm | Surface Mount Land Size | 8.3 x 8.3 mm | ||
| Tolerance | -20%~20% | Voltage | 6.3 V |
Overview of UWF0J151MCL1GS – Chip-type Low Impedance Aluminum Electrolytic Capacitor, 150 µF / 6.3 V
The UWF0J151MCL1GS from Nichicon is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It targets applications that require a compact surface-mount aluminum capacitor capable of operating across a wide temperature range and handling ripple currents typical of power decoupling and filtering tasks.
Key product strengths include a rated capacitance of 150 µF at 6.3 V, operation from -55 °C to +105 °C, AEC-Q200 rating for automotive use, and RoHS compliance. The part is compatible with automated assembly processes and carrier-tape mounting.
Key Features
- Capacitance & Voltage: 150 µF nominal capacitance at a 6.3 V rated voltage, with a capacitance tolerance of ±20% (120 Hz, 20 °C).
- Low Impedance Performance: Specified impedance of 800 mΩ and low-loss characteristics (tan δ max. 0.22 at 6.3 V, 120 Hz) for improved AC performance.
- Temperature Range & Endurance: Rated for -55 °C to +105 °C with endurance specified as 1000 hours at 105 °C under rated voltage, meeting defined capacitance, tan δ, and leakage criteria after recovery to 20 °C.
- Ripple Current Capability: Rated ripple current of 75 mA at 120 Hz and 150 mA at 10 kHz, with frequency-dependent ripple coefficients provided in the series data.
- Surface-Mount, Tape-Fed Package: Chip (radial, can - SMD) construction designed for surface mounting on high-density PCBs and applicable to automatic mounting machines fed with carrier tape; marking is black print on the case top.
- Automotive Qualification & Compliance: AEC-Q200 compliant and RoHS directive compliant (2011/65/EU, (EU)2015/863), supporting automotive and regulated-environment use cases.
- Physical Dimensions & Footprint: Size L: 6.2 × D: 8 mm with a recommended surface-mount land size of L: 8.3 × W: 8.3 mm for PCB layout.
- Leakage Current Specification: After 2 minutes at rated voltage and 20 °C, leakage current is ≤ 0.01CV or 3 µA, whichever is greater, per the datasheet definition.
Typical Applications
- Automotive Electronic Modules: Suited for automotive control modules and electronics where AEC-Q200 qualification and wide temperature range are required.
- Power Supply Smoothing and Decoupling: Used on high-density PCBs to provide bulk capacitance and reduce AC ripple within the limits of the specified ripple current and impedance.
- Surface-Mount High-Density Boards: Ideal for compact SMD layouts and automated tape-fed assembly processes in industrial and automotive electronics manufacturing.
Unique Advantages
- Low-impedance electrical performance: 800 mΩ impedance and defined tan δ at 6.3 V help improve AC stability in filtering and decoupling roles.
- High-temperature endurance: Rated to +105 °C with 1000-hour endurance at that temperature, supporting designs exposed to elevated thermal stress.
- Automotive-grade qualification: AEC-Q200 compliance enables use in automotive electronic systems that require industry-recognized component robustness.
- Board-level assembly compatibility: Chip package and carrier-tape compatibility simplify integration into automated surface-mount production lines.
- Regulatory compliance: RoHS directive compliance supports use in regulated supply chains and environmentally constrained designs.
- Compact footprint: Small form factor (6.2 × 8 mm) with defined land pattern guidance helps conserve PCB area on dense assemblies.
Why Choose UWF0J151MCL1GS?
UWF0J151MCL1GS combines compact chip packaging with low impedance, automotive-grade qualification, and high-temperature endurance to meet the needs of demanding power decoupling and smoothing applications on dense surface-mount PCBs. Its carrier-tape compatibility and clear electrical specifications make it suitable for automated manufacturing and predictable performance in regulated environments.
This part is a fit for designers and procurement teams seeking a surface-mount aluminum electrolytic capacitor with defined ripple current ratings, AEC-Q200 qualification, and RoHS compliance for automotive and industrial applications that require proven electrical and thermal behavior.
Request a quote or submit an inquiry for UWF0J151MCL1GS to discuss availability, pricing, and delivery options. Provide application context and required quantities so we can respond with tailored information.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016