UWF0J151MCL1GS

CAP ALUM 150UF ±20% 6.3V SMD
Part Description

150 µF 6.3 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,002 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUWF
ManufacturerNichicon
Manufacturing StatusEnd Of Life
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance150 µFECCNEAR99
ESRN/AHeight Seated (Max)6.2 mmHTS Code8532.22.0020
Impedance800 mOhmLead SpacingN/ALifetime @ Temp1000 h @ 105°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 105°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency150 mA @ 10 kHzRipple Current Low Frequency75 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension6.2 x 8 mmSurface Mount Land Size8.3 x 8.3 mm
Tolerance-20%~20%Voltage6.3 V

Overview of UWF0J151MCL1GS – Chip-type Low Impedance Aluminum Electrolytic Capacitor, 150 µF / 6.3 V

The UWF0J151MCL1GS from Nichicon is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It targets applications that require a compact surface-mount aluminum capacitor capable of operating across a wide temperature range and handling ripple currents typical of power decoupling and filtering tasks.

Key product strengths include a rated capacitance of 150 µF at 6.3 V, operation from -55 °C to +105 °C, AEC-Q200 rating for automotive use, and RoHS compliance. The part is compatible with automated assembly processes and carrier-tape mounting.

Key Features

  • Capacitance & Voltage: 150 µF nominal capacitance at a 6.3 V rated voltage, with a capacitance tolerance of ±20% (120 Hz, 20 °C).
  • Low Impedance Performance: Specified impedance of 800 mΩ and low-loss characteristics (tan δ max. 0.22 at 6.3 V, 120 Hz) for improved AC performance.
  • Temperature Range & Endurance: Rated for -55 °C to +105 °C with endurance specified as 1000 hours at 105 °C under rated voltage, meeting defined capacitance, tan δ, and leakage criteria after recovery to 20 °C.
  • Ripple Current Capability: Rated ripple current of 75 mA at 120 Hz and 150 mA at 10 kHz, with frequency-dependent ripple coefficients provided in the series data.
  • Surface-Mount, Tape-Fed Package: Chip (radial, can - SMD) construction designed for surface mounting on high-density PCBs and applicable to automatic mounting machines fed with carrier tape; marking is black print on the case top.
  • Automotive Qualification & Compliance: AEC-Q200 compliant and RoHS directive compliant (2011/65/EU, (EU)2015/863), supporting automotive and regulated-environment use cases.
  • Physical Dimensions & Footprint: Size L: 6.2 × D: 8 mm with a recommended surface-mount land size of L: 8.3 × W: 8.3 mm for PCB layout.
  • Leakage Current Specification: After 2 minutes at rated voltage and 20 °C, leakage current is ≤ 0.01CV or 3 µA, whichever is greater, per the datasheet definition.

Typical Applications

  • Automotive Electronic Modules: Suited for automotive control modules and electronics where AEC-Q200 qualification and wide temperature range are required.
  • Power Supply Smoothing and Decoupling: Used on high-density PCBs to provide bulk capacitance and reduce AC ripple within the limits of the specified ripple current and impedance.
  • Surface-Mount High-Density Boards: Ideal for compact SMD layouts and automated tape-fed assembly processes in industrial and automotive electronics manufacturing.

Unique Advantages

  • Low-impedance electrical performance: 800 mΩ impedance and defined tan δ at 6.3 V help improve AC stability in filtering and decoupling roles.
  • High-temperature endurance: Rated to +105 °C with 1000-hour endurance at that temperature, supporting designs exposed to elevated thermal stress.
  • Automotive-grade qualification: AEC-Q200 compliance enables use in automotive electronic systems that require industry-recognized component robustness.
  • Board-level assembly compatibility: Chip package and carrier-tape compatibility simplify integration into automated surface-mount production lines.
  • Regulatory compliance: RoHS directive compliance supports use in regulated supply chains and environmentally constrained designs.
  • Compact footprint: Small form factor (6.2 × 8 mm) with defined land pattern guidance helps conserve PCB area on dense assemblies.

Why Choose UWF0J151MCL1GS?

UWF0J151MCL1GS combines compact chip packaging with low impedance, automotive-grade qualification, and high-temperature endurance to meet the needs of demanding power decoupling and smoothing applications on dense surface-mount PCBs. Its carrier-tape compatibility and clear electrical specifications make it suitable for automated manufacturing and predictable performance in regulated environments.

This part is a fit for designers and procurement teams seeking a surface-mount aluminum electrolytic capacitor with defined ripple current ratings, AEC-Q200 qualification, and RoHS compliance for automotive and industrial applications that require proven electrical and thermal behavior.

Request a quote or submit an inquiry for UWF0J151MCL1GS to discuss availability, pricing, and delivery options. Provide application context and required quantities so we can respond with tailored information.

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