UWF0J220MCL1GB

The UWF0J220MCL1GB is a chip-type aluminum electrolytic capacitor engineered for surface-mount assembly and high-density PCBs. With a rated capacitance of 22 µF at 6.3 V, low impedance construction, and an operating temperature range from −55 °C to 105 °C, it addresses decoupling and smoothing needs in compact, thermally demanding systems.

Designed to support automated placement via embossed carrier taping and qualified to AEC-Q200, this device is suitable for applications requiring robust temperature endurance and industry-standard environmental compliance (RoHS).

Key Features

• Capacitance & Tolerance — 22 µF nominal with ±20% tolerance at 120 Hz, 20 °C, providing predictable energy storage for power rail stabilization.
• Rated Voltage — 6.3 V DC rating for low-voltage power systems and board-level decoupling.
• Low Impedance Construction — Specified impedance of 5 Ω to reduce ripple and improve transient response in power supply circuits.
• Temperature & Endurance — Operational range −55 °C to +105 °C with endurance of 1000 hours at 105 °C, enabling reliable performance in elevated-temperature environments.
• Surface-Mount Chip Package — Radial, can-type SMD (φ4 × 5.4 mm) with surface-mount land size 4.3 × 4.3 mm for compact PCB layouts.
• Assembly Ready — Supplied in embossed carrier taping compatible with automated mounting machines to streamline high-volume production.
• Standards & Compliance — AEC-Q200 rated and RoHS compliant to meet automotive-grade reliability and environmental requirements.
• Polarized — Polarized aluminum electrolytic design for correct orientation in DC smoothing and filtering roles.
• Ripple Current Ratings — Specified ripple handling of 25 mA at 120 Hz and 50 mA at 10 kHz for low-frequency and high-frequency ripple conditions.

Typical Applications

• Automotive Electronic Modules — Intended for use in vehicle electronic control units and modules where AEC-Q200-rated capacitors and high-temperature endurance are required.
• Power Supply Filtering — Surface-mount chip form factor and low impedance make it suitable for board-level smoothing and decoupling on compact power rails.
• High-Density PCB Designs — Small φ4 × 5.4 mm package and SMD mounting support space-constrained, automated-assembly applications.

Unique Advantages

• AEC-Q200 Qualification: Validates suitability for designs that require automotive-grade component reliability.
• High-Temperature Endurance: 1000 hours at 105 °C supports extended operation in thermally challenging environments.
• Low Impedance: 5 Ω impedance reduces voltage ripple and improves transient handling on power rails.
• Compact SMD Form Factor: φ4 × 5.4 mm can package and small land footprint enable dense PCB routing and space savings.
• Production-Ready Taping: Embossed carrier taping streamlines automated pick-and-place processing for volume manufacturing.
• Regulatory Compliance: RoHS compliance addresses environmental requirements for modern electronics production.

Why Choose UWF0J220MCL1GB?

UWF0J220MCL1GB combines a compact chip-style SMD package with low impedance and AEC-Q200-level qualification, making it a practical choice for engineers specifying capacitors for temperature-stressed, space-constrained designs. Its rated 22 µF capacitance at 6.3 V and defined ripple current characteristics provide clear, verifiable performance for power filtering and decoupling tasks.

Manufactured by Nichicon and supplied in embossed carrier tape for automated assembly, this capacitor suits projects that require consistent part geometry, manufacturability, and compliance with environmental and industry reliability standards.

If you would like pricing, availability, or a formal quote for UWF0J220MCL1GB, please submit a request and our team will respond with a tailored quotation and ordering information.