UWF0J470MCL1GB

The UWF0J470MCL1GB is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mounting on high‑density PC boards. Its compact SMD can package and tape‑feed compatibility make it suitable for automated assembly in automotive and industrial electronics.

Specified for operation from −55 °C to +105 °C with a rated capacitance of 47 µF at 6.3 V, this part balances compact size with endurance and ripple handling for demanding board‑level power applications.

Key Features

• Capacitance & Voltage — 47 µF rated capacitance with a 6.3 V nominal voltage and ±20% tolerance for predictable energy storage at low voltage rails.
• Low Impedance — Specified impedance of 2.6 Ω supports lower loss and improved performance in AC and transient conditions.
• Temperature & Endurance — Operating range from −55 °C to +105 °C with rated endurance of 1000 hours at 105 °C for sustained high‑temperature operation.
• Ripple Current Capability — Ripple current ratings of 40 mA at 120 Hz and 80 mA at 10 kHz to support frequency‑dependent ripple handling.
• Package & Mounting — Chip can SMD package (L: 5.4 × D: 5 mm) with surface‑mount land recommendation (5.3 × 5.3 mm) and compatibility with carrier‑tape automatic placement.
• Standards & Compliance — AEC‑Q200 listed and RoHS compliant for regulated environments and reliability‑focused designs.

Typical Applications

• Automotive Electronics — Suitable for surface‑mounted assemblies in automotive modules where AEC‑Q200 qualification is required.
• Board‑Level Power Filtering — Used on high‑density PCBs to provide bulk capacitance and ripple handling on low‑voltage power rails.
• Automated Assembly Workflows — Designed for placement from carrier tape, enabling efficient use in automated high‑volume manufacturing.

Unique Advantages

• Reliable High‑Temperature Operation: Rated to +105 °C with a 1000‑hour endurance specification to support sustained elevated‑temperature use.
• AEC‑Q200 Coverage: Offers the compliance needed for designs that require automotive‑grade component qualification.
• Compact SMD Can: Small footprint (5.4 × 5 mm) and defined land pattern (5.3 × 5.3 mm) simplify PCB layout and save board area.
• Tape‑Feed Compatible: Built for automatic mounting machines fed with carrier tape to streamline assembly and reduce handling time.
• Measured Ripple Performance: Published ripple current figures at low and high frequency (40 mA @ 120 Hz, 80 mA @ 10 kHz) allow designers to evaluate suitability for specific power‑rail conditions.
• RoHS Compliant: Meets applicable RoHS directives for use in regulated markets.

Why Choose UWF0J470MCL1GB?

The UWF0J470MCL1GB combines a compact chip can package with low impedance characteristics and defined ripple ratings, making it a practical choice for surface‑mount power decoupling and filtering on space‑constrained PCBs. Its qualified temperature range and 1000‑hour endurance at 105 °C provide predictable performance in thermal environments.

This part is positioned for designers and manufacturers who need an AEC‑Q200‑rated, tape‑feed compatible aluminum electrolytic capacitor for automotive and industrial surface‑mount assemblies, delivering component-level reliability and a small PCB footprint.

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