UWD1V220MCL1GS

The UWD1V220MCL1GS is a chip-type aluminum electrolytic capacitor in Nichicon’s UWD series, engineered for surface-mount applications on high-density PC boards. It delivers 22 µF at 35 V in a compact radial can SMD package (L: 5.8 × D: 5 mm) with a surface-mount land size of 5.3 × 5.3 mm.

This device is a low-impedance capacitor rated for operation from −55 °C to +105 °C, designed to withstand high-temperature assembly processes and long-term operation (2,000 hours at 105 °C). It is AEC-Q200 qualified and RoHS compliant, meeting requirements for demanding automotive and industrial environments.

Key Features

• Electrical — Capacitance & Voltage: 22 µF rated capacitance at 35 V, with polarization suitable for DC applications. Capacitance tolerance is ±20% (−20% to +20%).
• Low Impedance Performance: Specified impedance of 760 mΩ, with ripple current ratings of 75 mA at 120 Hz and 150 mA at 10 kHz for reliable filtering and smoothing in constrained designs.
• Thermal & Endurance: Operates across −55 °C to +105 °C and meets endurance requirements of 2,000 hours at 105 °C as specified for the series.
• High-Temperature Reflow Compatibility: Designed to correspond with 260 °C peak reflow soldering. Recommended reflow condition: 260 °C peak for 5 seconds; 230 °C over 60 seconds (2 times) with specific allowances noted in the series datasheet.
• Package & Mounting: Chip-type radial can SMD package intended for surface mounting on high-density PCBs; compatible with automatic mounting machines fed with carrier tape.
• Standards & Compliance: AEC-Q200 qualified and RoHS directive compliant (2011/65/EU, (EU)2015/863), supporting regulated design requirements.

Typical Applications

• Automotive electronics: Suitable for use in automotive modules where AEC-Q200 qualification and operation to +105 °C are required.
• High-density surface-mount PCBs: Designed for placement on compact, densely populated boards where a small radial can SMD capacitor is needed.
• Automated assembly lines: Applicable to automatic mounting machines fed with carrier tape, simplifying integration into high-volume production.

Unique Advantages

• AEC-Q200 qualification: Provides the documented supplier qualification required for many automotive and harsh-environment applications.
• High-temperature reflow compatibility: Supports 260 °C peak reflow processes, enabling use with lead‑free, high-temperature assembly flows.
• Compact SMD radial can: 22 µF in a 5.8 × 5 mm footprint with a 5.3 × 5.3 mm land pattern, reducing board space without sacrificing capacitance.
• Robust thermal endurance: Rated for 2,000 hours at 105 °C, offering predictable long-term performance in elevated-temperature environments.
• Low impedance and defined ripple handling: 760 mΩ impedance with specified ripple currents at 120 Hz and 10 kHz for stable decoupling and smoothing performance.
• Production-ready packaging: Applicable to automatic mounting via carrier tape to support efficient pick-and-place assembly workflows.

Why Choose UWD1V220MCL1GS?

UWD1V220MCL1GS combines a compact chip-type aluminum electrolytic form factor with low impedance, clear ripple-current specifications, and endurance at elevated temperature, making it well suited to demanding board-level power applications. Its compatibility with high-temperature reflow processes and automatic mounting supports robust manufacturing flows for automotive and industrial products.

Choose this part when you need an AEC-Q200 qualified, RoHS-compliant SMD capacitor that balances space efficiency, thermal endurance, and assembly compatibility for long-lived designs in regulated environments.

Request a quote or contact sales to discuss availability, lead times and volume pricing for UWD1V220MCL1GS.