UWD1E101MCL1GS

The UWD1E101MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount applications. Optimized for high-temperature reflow processes and built for use on high-density PC boards, it targets applications that require AEC-Q200 qualification and stable operation up to +105°C.

Its compact SMD can package and robust electrical profile make it suitable for automotive modules and other assemblies that require reliable filtering and energy storage under elevated temperature and assembly stress conditions.

Key Features

• Core Electricals — 100 µF capacitance at a 25 V rated voltage with ±20% tolerance; polarized construction for DC applications.
• Low Impedance Performance — Specified impedance of 340 mΩ, with tested ripple current ratings of 140 mA at 120 Hz and 280 mA at 10 kHz to support dynamic load conditions.
• High-Temperature Operation & Endurance — Rated for operation from −55°C to +105°C with a lifetime specification of 2000 hours at +105°C.
• Reflow and Soldering Robustness — Engineered to withstand 260°C peak reflow soldering (recommended: 260°C peak 5 s; 230°C over 60 s, two passes as specified) and meets soldering-heat resistance criteria (hot plate 250°C for 30 s).
• Package & Mounting — Compact dimensions L: 7.7 × D: 6.3 mm in an SMD can; recommended PCB land size L: 6.6 × W: 6.6 mm and compatible with carrier-tape fed automatic mounting machines.
• Reliability & Standards — AEC-Q200 qualified and RoHS compliant, with leakage current limits defined by 0.01 CV or 3 µA (whichever is greater) after 2 minutes at 20°C.

Typical Applications

• Automotive modules — AEC-Q200 qualification and +105°C rating make this part suitable for electronic modules that require qualified, high-temperature-capable capacitors.
• High-density PCB assemblies — Designed for surface mounting on high-density PC boards and compatible with tape-fed automatic mounting equipment.
• Reflow-assembled systems — Engineered specifically to withstand 260°C peak reflow soldering per the recommended conditions for modern SMT assembly processes.

Unique Advantages

• High-temperature reflow compatibility: Supports 260°C peak reflow (recommended profile provided), simplifying integration into standard lead-free assembly flows.
• AEC-Q200 qualification: Enables use in designs that require automotive-grade component qualification.
• Low-impedance design: 340 mΩ impedance and defined ripple current ratings help maintain stable performance under load.
• Compact SMD can package: Small L: 7.7 × D: 6.3 mm footprint with a 6.6 × 6.6 mm recommended land pattern for space-constrained boards.
• Robust endurance: Specified for 2000 hours at +105°C, supporting longer life in elevated-temperature environments.
• RoHS compliant: Meets RoHS directives for restricted substances in electronic assemblies.

Why Choose UWD1E101MCL1GS?

UWD1E101MCL1GS positions itself as a reliable, compact SMD electrolytic capacitor for applications that combine high-temperature operation, reflow assembly compatibility, and automotive-grade qualification. With a 100 µF / 25 V rating, low impedance, and defined ripple current performance, it addresses designs that demand stable capacitance and durability on densely populated PCBs.

This part is suited for engineers and procurement teams specifying components for automotive modules and other assemblies where AEC-Q200 qualification, RoHS compliance, and reflow robustness are required. Its compact package and recommended land pattern help simplify board layout while delivering a defined endurance profile at elevated temperatures.

Request a quote or contact sales to obtain pricing, lead-time, and availability for UWD1E101MCL1GS.