UWD1E100MCL1GS

The UWD1E100MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount use on high-density PCBs. It delivers 10 µF capacitance at 25 V in a compact radial can SMD package with low impedance behavior and polarization for DC decoupling and smoothing.

Engineered for high-temperature assembly and operation, this part supports 260 °C peak reflow soldering and operates over a −55 °C to +105 °C range. It is AEC-Q200 qualified and RoHS compliant, making it suitable for automotive and other demanding, reliability-focused applications that require automated placement.

Key Features

• Capacitance & Voltage — 10 µF rated capacitance at 25 V for bulk decoupling and energy storage in power rails.
• High-temperature reflow compatible — Designed to withstand 260 °C peak reflow (recommended: 260 °C peak 5 s; 230 °C over 60 s, 2×), enabling modern lead‑free assembly processes.
• Wide operating temperature — Specified for −55 °C to +105 °C operation to support high-temperature environments.
• Low impedance — Impedance of 1.8 Ω (part-specific) for improved ripple handling and more effective filtering at relevant frequencies.
• Ripple current capability — 40 mA at 120 Hz and 80 mA at 10 kHz to address low- and high-frequency ripple in power systems.
• Durability and lifetime — Rated lifetime of 2000 hours at 105 °C, with endurance characteristics defined in the datasheet.
• Package & placement — Radial, can-style SMD (L: 5.8 × D: 4 mm) with recommended land size 4.3 × 4.3 mm; compatible with carrier-tape automated mounting.
• Quality & compliance — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronic control units — AEC‑Q200 qualification and 105 °C operation make this capacitor suitable for decoupling and smoothing in vehicle ECUs.
• High-density surface-mount assemblies — Compact radial can SMD size and recommended land pattern support board-area constrained designs.
• Automated production lines — Designed for carrier-tape feed and placement by automatic mounting machines, matching high-volume SMT workflows.

Unique Advantages

• Reflow-ready for modern assembly: Rated for 260 °C peak reflow, enabling reliable lead‑free soldering processes without additional process constraints.
• Automotive-grade reliability: AEC‑Q200 qualification provides a recognized baseline for use in automotive applications requiring component-level qualification.
• Compact, PCB-friendly package: Small L: 5.8 × D: 4 mm footprint and defined land pattern make it straightforward to integrate into dense board layouts.
• Low impedance and defined ripple handling: Rated impedance (1.8 Ω) and ripple current specs (40 mA @ 120 Hz, 80 mA @ 10 kHz) help designers meet filtering and stability targets.
• High-temperature operation and lifecycle: Specified for −55 °C to +105 °C and 2000 hours at 105 °C, supporting long-term performance in elevated-temperature environments.
• RoHS compliant: Conforms to 2011/65/EU and (EU)2015/863 for environmental compliance in global products.

Why Choose UWD1E100MCL1GS?

The UWD1E100MCL1GS combines a compact SMD radial can form factor with low impedance characteristics, AEC‑Q200 qualification, and high-temperature reflow compatibility. It is positioned for designers who need a reliable 10 µF, 25 V electrolytic capacitor that integrates into automated SMT lines and operates across −55 °C to +105 °C.

This part is well suited to automotive electronics and other applications where board density, high-temperature processing, and defined ripple performance are required. Its lifecycle and compliance credentials provide predictable long-term performance within certified development and production environments.

Request a quote or contact sales to discuss availability, volume pricing, and technical fit for your design needs.