UWD1C220MCL1GS

The UWD1C220MCL1GS is a chip‑type aluminum electrolytic capacitor engineered for surface‑mount, high‑density PCBs. It delivers low impedance performance in a compact SMD can package and is optimized for automated assembly processes.

Designed for demanding environments, this part supports a wide operating temperature range and is AEC‑Q200 qualified and RoHS compliant, making it suitable for automotive and industrial electronic assemblies that require robust, reliable bulk capacitance in a small footprint.

Key Features

• Chip‑Type SMD Package Compact radial can designed for surface mounting on high‑density PC boards; compatible with carrier‑tape automated placement.
• Reflow Compatible Corresponds with 260°C peak reflow soldering (recommended: 260°C peak 5 s; 230°C over 60 s per datasheet guidance).
• Electrical Specification 22 µF nominal capacitance at 16 V rated voltage with ±20% tolerance and a measured impedance of 760 mΩ.
• Temperature and Endurance Operating temperature −55°C to +105°C and rated for 2000 hours at 105°C, supporting extended operation in elevated ambient conditions.
• Ripple Handling Ripple current ratings of 75 mA at 120 Hz and 150 mA at 10 kHz enable use in decoupling and power applications where ripple performance matters.
• Automotive Qualification and Compliance AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), supporting regulated manufacturing and quality requirements.
• Board Footprint Small footprint with part dimensions L: 5.8 × D: 5 mm and recommended land size L: 5.3 × W: 5.3 mm for compact SMT layouts.

Typical Applications

• Automotive Electronics Suitable for electronic control modules and other in‑vehicle circuits where AEC‑Q200 qualification and elevated temperature endurance are required.
• High‑Density PCB Assemblies Designed for surface mounting on compact, densely populated boards to provide local bulk capacitance without sacrificing board area.
• Automated Production Lines Compatible with carrier‑tape feeding for pick‑and‑place assembly, supporting high‑volume automated manufacturing workflows.

Unique Advantages

• Reflow‑ready construction Rated for 260°C peak reflow processes, enabling compatibility with modern SMT assembly flows.
• Automotive‑grade qualification AEC‑Q200 qualification provides traceable assurance for automotive and other regulated applications.
• Compact, low‑impedance design 22 µF at 16 V with 760 mΩ impedance provides usable bulk capacitance in a small SMD can, helping reduce board space.
• High‑temperature endurance Rated operation up to +105°C and 2000 hours endurance at 105°C for stability in elevated ambient conditions.
• Assembly friendly SMD chip format and carrier‑tape compatibility simplify automated placement and reduce handling complexity.
• Regulatory compliance RoHS compliant to applicable directives, supporting environmentally regulated product builds.

Why Choose UWD1C220MCL1GS?

The UWD1C220MCL1GS combines a compact SMD can format with low impedance performance and automotive‑grade qualification, making it a strong choice for engineers designing space‑constrained, high‑reliability electronics. Its tolerance for high reflow temperatures, specified ripple current ratings, and extended high‑temperature endurance address common needs in automotive and industrial assemblies.

This part is well suited to designs that require reliable bulk capacitance near power rails on high‑density PCBs, particularly where automated assembly and regulatory compliance are part of the production requirements.

Request a quote or contact sales to discuss availability, pricing, and how UWD1C220MCL1GS can meet your design and production needs.