UWD1C270MCL1GS

The UWD1C270MCL1GS is a chip-type aluminum electrolytic capacitor in Nichicon’s UWD series, designed for surface-mount assembly on high‑density PC boards. It delivers 27 µF at 16 V in a compact radial can SMD package with low impedance and a wide operating temperature range from −55 °C to +105 °C.

Key value propositions include compatibility with high‑temperature reflow processes, AEC‑Q200 qualification for automotive designs, RoHS compliance, and form factor and handling characteristics suited to automated assembly lines.

Key Features

• Capacitance and Voltage — 27 µF rated capacitance at 16 V provides a compact energy-storage solution for SMD assemblies.
• High‑Temperature Reflow Ready — Corresponds with 260 °C peak reflow soldering (recommended: 260 °C peak for 5 seconds; 230 °C over 60 seconds, repeated 2 times except φ10 × 10: 1 time).
• Temperature and Endurance — Rated for operation from −55 °C to +105 °C with a specified lifetime of 2000 hours at 105 °C.
• Low Impedance — Specified impedance of 760 mΩ to support lower ESR requirements in compact SMD designs.
• Ripple Current Performance — 75 mA at 120 Hz (low frequency) and 150 mA at 10 kHz (high frequency) for handling AC ripple in real-world conditions.
• Packaging and Mounting — Chip-type radial can SMD (L: 5.8 × D: 5 mm) designed for surface mounting on high‑density PCBs and compatible with automatic mounting machines fed with carrier tape.
• Reliability and Compliance — Polarized aluminum electrolytic construction, AEC‑Q200 qualified, and RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Suitable for use in automotive electronic modules that require AEC‑Q200‑qualified components and high‑temperature assembly processes.
• High‑Density PCB Assemblies — Compact SMD chip type designed for placement on dense boards where board space and automated placement are priorities.
• Automated Reflow Production — Built to withstand 260 °C peak reflow profiles and compatible with carrier‑tape feeding for automatic mounting machines.

Unique Advantages

• Reflow Process Compatibility: Supports 260 °C peak reflow profiles (recommended conditions provided), enabling use in lead‑free, high‑temperature assembly flows.
• Automotive‑Grade Qualification: AEC‑Q200 qualification aligns the part with automotive design requirements where applicable.
• Compact SMD Form Factor: 5.8 × 5 mm radial can SMD package saves board space and supports high‑density layouts and automated placement.
• Thermal and Operational Robustness: Rated for −55 °C to +105 °C with a specified 2000‑hour endurance at 105 °C, supporting sustained operation at elevated temperatures.
• Measured Electrical Characteristics: Low impedance (760 mΩ) and specified ripple current values (75 mA at 120 Hz, 150 mA at 10 kHz) provide verifiable performance parameters for design margins.
• Regulatory Compliance: RoHS compliant to 2011/65/EU and (EU)2015/863, supporting environmental regulation requirements.

Why Choose UWD1C270MCL1GS?

UWD1C270MCL1GS positions itself as a compact, assembly‑friendly aluminum electrolytic solution for demanding SMD designs that require high‑temperature reflow compatibility and proven reliability. Its AEC‑Q200 qualification and RoHS compliance make it suitable for engineered applications where regulated components and established endurance at elevated temperature are required.

This part is a strong fit for design teams seeking a small, low‑impedance polarized capacitor for automated surface‑mount production, high‑density PCBs, and applications that require documented endurance and ripple performance.

If you would like pricing or availability for UWD1C270MCL1GS, request a quote or submit an inquiry to evaluate this capacitor for your next design.