UWD1C101MCL1GS
| Part Description |
100 µF 16 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,781 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWD |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 100 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 6.1 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 440 mOhm | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 230 mA @ 10 kHz | Ripple Current Low Frequency | 115 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.8 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 16 V |
Overview of UWD1C101MCL1GS – 100 µF, 16 V Aluminum Electrolytic SMD Capacitor
The UWD1C101MCL1GS is a chip-type aluminum electrolytic capacitor engineered for surface-mount applications requiring low impedance and high-temperature reflow compatibility. It delivers 100 µF at 16 V in a compact SMD can designed for automatic mounting on high-density PC boards.
Targeted use includes automotive applications and assemblies that require RoHS compliance, AEC-Q200 qualification, and reliable operation across a wide temperature range up to +105°C.
Key Features
- Capacitance & Voltage: 100 µF capacitance with a rated voltage of 16 V and ±20% tolerance at 120 Hz, 20°C, suitable for decoupling and bulk storage where specified capacitance is required.
- Low Impedance Performance: Low impedance construction with a specified impedance of 440 mOhm, improving ripple handling and transient response in compact power circuits.
- High-Temperature Operation: Rated for operation from −55°C to +105°C with endurance specified at 2000 hours at 105°C for the stated dimensions.
- High-Temperature Reflow Compatible: Chip-type capacitor compatible with 260°C peak reflow (recommended: 260°C peak for 5 s; 230°C over 60 s) to match modern lead-free assembly processes.
- Automotive-Grade Qualification: AEC-Q200 qualified and listed for automotive applications, supporting designs that require recognized reliability standards.
- Surface-Mount Package: Radial can SMD package sized L: 5.8 × D: 6.3 mm with recommended land size L: 6.6 × W: 6.6 mm; applicable to automatic mounting with carrier tape for high-volume assembly.
- Reliable Lifetime & Ripple Ratings: Specified lifetime of 2000 hours at 105°C and ripple current ratings of 115 mA at 120 Hz and 230 mA at 10 kHz for sustained operation under ripple conditions.
- Environmental Compliance: Compliant with RoHS directive (2011/65/EU, (EU)2015/863).
Typical Applications
- Automotive Electronics: Use in automotive control modules and electronics where AEC-Q200 qualification and operation up to +105°C are required.
- High-Density Surface-Mount PCBs: Designed for compact PCB assemblies that require automatic mounting and small SMD can footprints.
- Lead-Free Manufacturing Lines: Suited to production processes that require components compatible with 260°C peak reflow.
- RoHS-Compliant Designs: For applications and product lines that mandate ROHS directive conformance.
Unique Advantages
- Reflow-Ready for Lead-Free Assembly: Explicit compatibility with 260°C peak reflow enables integration into modern lead-free soldering processes without special handling.
- Automotive-Grade Reliability: AEC-Q200 qualification provides documented suitability for automotive system requirements and higher reliability expectations.
- Compact, SMD Can Footprint: Small L: 5.8 × D: 6.3 mm package and defined land pattern support high-density board layouts and automated placement.
- Designed for Elevated Temperatures: Rated to +105°C with a defined endurance (2000 h at 105°C), enabling stable performance in thermally demanding environments.
- Low Impedance and Defined Ripple Specs: 440 mOhm impedance and specified ripple current values help maintain performance under AC ripple and switching conditions.
- Assembly-Friendly: Carrier-tape compatible and engineered for automatic mounting to streamline high-volume production.
Why Choose UWD1C101MCL1GS?
UWD1C101MCL1GS combines a compact SMD can form factor with low-impedance electrolytic performance and explicit high-temperature reflow compatibility, making it a practical choice for designs that require automated assembly and reliable operation up to +105°C. Its AEC-Q200 qualification and RoHS compliance make it suitable for regulated, high-reliability programs.
This part is well suited to engineers specifying components for automotive and other demanding designs where verified endurance (2000 hours at 105°C), controlled impedance, and compatibility with lead-free assembly processes are required. The defined mechanical footprint and land size support predictable layout and placement in high-density boards.
To request pricing, availability, or a formal quotation for UWD1C101MCL1GS, please contact sales or submit a request for a quote with your quantity and delivery requirements.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016