UWD1C101MCL1GS

CAP ALUM 100UF ±20% 16V SMD
Part Description

100 µF 16 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,781 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUWD
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance100 µFECCNEAR99
ESRN/AHeight Seated (Max)6.1 mmHTS Code8532.22.0020
Impedance440 mOhmLead SpacingN/ALifetime @ Temp2000 h @ 105°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 105°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency230 mA @ 10 kHzRipple Current Low Frequency115 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension5.8 x 6.3 mmSurface Mount Land Size6.6 x 6.6 mm
Tolerance-20%~20%Voltage16 V

Overview of UWD1C101MCL1GS – 100 µF, 16 V Aluminum Electrolytic SMD Capacitor

The UWD1C101MCL1GS is a chip-type aluminum electrolytic capacitor engineered for surface-mount applications requiring low impedance and high-temperature reflow compatibility. It delivers 100 µF at 16 V in a compact SMD can designed for automatic mounting on high-density PC boards.

Targeted use includes automotive applications and assemblies that require RoHS compliance, AEC-Q200 qualification, and reliable operation across a wide temperature range up to +105°C.

Key Features

  • Capacitance & Voltage: 100 µF capacitance with a rated voltage of 16 V and ±20% tolerance at 120 Hz, 20°C, suitable for decoupling and bulk storage where specified capacitance is required.
  • Low Impedance Performance: Low impedance construction with a specified impedance of 440 mOhm, improving ripple handling and transient response in compact power circuits.
  • High-Temperature Operation: Rated for operation from −55°C to +105°C with endurance specified at 2000 hours at 105°C for the stated dimensions.
  • High-Temperature Reflow Compatible: Chip-type capacitor compatible with 260°C peak reflow (recommended: 260°C peak for 5 s; 230°C over 60 s) to match modern lead-free assembly processes.
  • Automotive-Grade Qualification: AEC-Q200 qualified and listed for automotive applications, supporting designs that require recognized reliability standards.
  • Surface-Mount Package: Radial can SMD package sized L: 5.8 × D: 6.3 mm with recommended land size L: 6.6 × W: 6.6 mm; applicable to automatic mounting with carrier tape for high-volume assembly.
  • Reliable Lifetime & Ripple Ratings: Specified lifetime of 2000 hours at 105°C and ripple current ratings of 115 mA at 120 Hz and 230 mA at 10 kHz for sustained operation under ripple conditions.
  • Environmental Compliance: Compliant with RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

  • Automotive Electronics: Use in automotive control modules and electronics where AEC-Q200 qualification and operation up to +105°C are required.
  • High-Density Surface-Mount PCBs: Designed for compact PCB assemblies that require automatic mounting and small SMD can footprints.
  • Lead-Free Manufacturing Lines: Suited to production processes that require components compatible with 260°C peak reflow.
  • RoHS-Compliant Designs: For applications and product lines that mandate ROHS directive conformance.

Unique Advantages

  • Reflow-Ready for Lead-Free Assembly: Explicit compatibility with 260°C peak reflow enables integration into modern lead-free soldering processes without special handling.
  • Automotive-Grade Reliability: AEC-Q200 qualification provides documented suitability for automotive system requirements and higher reliability expectations.
  • Compact, SMD Can Footprint: Small L: 5.8 × D: 6.3 mm package and defined land pattern support high-density board layouts and automated placement.
  • Designed for Elevated Temperatures: Rated to +105°C with a defined endurance (2000 h at 105°C), enabling stable performance in thermally demanding environments.
  • Low Impedance and Defined Ripple Specs: 440 mOhm impedance and specified ripple current values help maintain performance under AC ripple and switching conditions.
  • Assembly-Friendly: Carrier-tape compatible and engineered for automatic mounting to streamline high-volume production.

Why Choose UWD1C101MCL1GS?

UWD1C101MCL1GS combines a compact SMD can form factor with low-impedance electrolytic performance and explicit high-temperature reflow compatibility, making it a practical choice for designs that require automated assembly and reliable operation up to +105°C. Its AEC-Q200 qualification and RoHS compliance make it suitable for regulated, high-reliability programs.

This part is well suited to engineers specifying components for automotive and other demanding designs where verified endurance (2000 hours at 105°C), controlled impedance, and compatibility with lead-free assembly processes are required. The defined mechanical footprint and land size support predictable layout and placement in high-density boards.

To request pricing, availability, or a formal quotation for UWD1C101MCL1GS, please contact sales or submit a request for a quote with your quantity and delivery requirements.

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