UWG1E330MCL1GB

The UWG1E330MCL1GB is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mounting on high‑density printed circuit boards. It is rated 33 µF at 25 V and is compliant with RoHS (2011/65/EU, (EU)2015/863) and AEC‑Q200 qualified for use in demanding environments.

Key value comes from its compact SMD package and specifications tuned for robust operation across a wide temperature range (−55 °C to +105 °C), with endurance specified for 1000 hours at 105 °C.

Key Features

• Capacitance & Voltage — 33 µF rated capacitance at 25 V with tolerance of −20% to +20%.
• Temperature & Endurance — Operates from −55 °C to +105 °C; endurance specified as 1000 hours at 105 °C.
• Low Impedance & Ripple Capability — Characterized as low impedance with an impedance value of 1 Ω and ripple current ratings of 70 mA at 120 Hz and 140 mA at 10 kHz.
• Package & Mounting — Chip type, radial can SMD package optimized for surface mounting on high‑density PCBs and applicable to automatic mounting machines fed with carrier tape. Physical size: L: 5.4 × D: 6.3 mm; recommended land size: 6.6 × 6.6 mm; seated height max 5.4 mm.
• Reliability & Qualification — AEC‑Q200 qualified to support designs requiring automotive‑grade component qualification.
• Environmental Compliance — RoHS compliant to support regulatory requirements.

Typical Applications

• Automotive electronics — AEC‑Q200 qualification and temperature endurance make it suitable for board‑level capacitor needs in automotive modules.
• High‑density SMD assemblies — Chip package and compact footprint enable use on tightly packed PCBs where board space is constrained.
• Automated assembly lines — Designed for automatic mounting with carrier tape, supporting high‑volume surface‑mount production.

Unique Advantages

• AEC‑Q200 Qualification: Helps meet automotive qualification requirements and reduces additional component-level qualification effort.
• Wide operating temperature range: −55 °C to +105 °C supports electronics exposed to broad thermal conditions.
• Compact SMD chip form factor: Small L: 5.4 × D: 6.3 mm footprint and defined land pattern (6.6 × 6.6 mm) help maximize board density.
• Specified high‑temperature endurance: Rated for 1000 hours at 105 °C, providing measurable long‑term stability for heat‑stressed designs.
• Defined ripple handling and low impedance: 1 Ω impedance with ripple current specifications at 120 Hz and 10 kHz enables confident filtering and smoothing design decisions.
• RoHS compliance: Meets environmental requirements for regulated markets.

Why Choose UWG1E330MCL1GB?

UWG1E330MCL1GB combines a compact chip‑type SMD package with clearly specified electrical and environmental characteristics—33 µF at 25 V, low impedance, defined ripple current ratings, and wide temperature endurance—making it well suited for engineered designs that require reliable, space‑efficient capacitors. Its AEC‑Q200 qualification and 1000‑hour endurance at 105 °C position it for use in applications where component qualification and thermal durability are priorities.

This part is appropriate for engineers and procurement teams targeting automotive and other demanding, high‑density surface‑mount designs that require verifiable specifications for long‑term performance and regulatory compliance.

Request a quote or submit an RFQ to evaluate UWG1E330MCL1GB for your next design or production run.