UWG1E331MNL1GS

The UWG1E331MNL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor from the UWG series designed for surface mounting on high‑density printed circuit boards. It delivers 330 µF capacitance at a 25 V rating in a compact SMD radial can package with a 1.0 × 1.0 cm footprint.

Engineered for demanding temperature and reliability requirements, this capacitor supports an operating temperature range of −55 °C to +105 °C, is AEC‑Q200 qualified, RoHS compliant, and is applicable to automatic mounting machines fed with carrier tape.

Key Features

• Capacitance & Voltage — 330 µF nominal capacitance, rated for 25 V operation with ±20% tolerance at 120 Hz, 20 °C.
• Low Impedance — Specified impedance of 150 mΩ supports applications that require lower ESR in a compact package.
• Wide Temperature Range — Operates from −55 °C to +105 °C, suitable for thermally demanding environments.
• Automotive Qualification — AEC‑Q200 qualified and listed for automotive applications in the product data.
• Endurance & Reliability — Rated for 1000 hours at 105 °C under rated voltage per the UWG series endurance specification.
• Ripple Current Capability — Supports 335 mA at 120 Hz and 670 mA at 10 kHz, per the product specifications.
• Surface‑Mount Chip Package — Chip‑type radial can SMD designed for high‑density PCBs; compatible with carrier‑tape automatic mounting.
• Compliance — RoHS directive compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — AEC‑Q200 qualification and wide temperature range make this capacitor suitable for automotive electronic modules requiring robust power decoupling.
• High‑Density PCB Power Filtering — Chip‑type SMD package and low impedance support localized smoothing and decoupling on compact boards.
• Power Supply Modules — 330 µF / 25 V and specified ripple current ratings enable use in DC‑DC converters and regulator output filtering.

Unique Advantages

• Automotive‑grade Reliability: AEC‑Q200 qualification indicates suitability for automotive electronic assemblies where that qualification is required.
• Robust Thermal Performance: −55 °C to +105 °C operating range and 1000 h endurance at 105 °C offer predictable behavior in elevated temperature applications.
• Compact SMD Footprint: 1.0 × 1.0 cm package with a 1.03 × 1.03 cm recommended land size enables placement on high‑density boards.
• Low ESR and Defined Ripple Handling: 150 mΩ impedance and ripple current specs (335 mA @120 Hz, 670 mA @10 kHz) provide measurable performance for power conditioning.
• Assembly Ready: Designed for automatic mounting with carrier tape, easing integration into automated production lines.
• Regulatory Compliance: RoHS conformity aligns with environmental and regulatory requirements.

Why Choose UWG1E331MNL1GS?

UWG1E331MNL1GS combines a high capacitance density (330 µF) and low impedance (150 mΩ) in a compact chip‑type SMD package, making it well suited for demanding power‑filtering roles on space‑constrained PCBs. Its wide operating temperature range, 1000‑hour endurance at 105 °C, and AEC‑Q200 qualification position it for reliable use in automotive and other temperature‑challenging environments.

This part is appropriate for engineers and procurement teams specifying components for robust, long‑life power delivery and decoupling needs where surface‑mount assembly and regulatory compliance are required.

Request a quote or submit an inquiry for UWG1E331MNL1GS to receive pricing and availability information from our sales team.