UWP1A330MCL1GB

The UWP1A330MCL1GB is a Nichicon UWP series aluminum electrolytic chip capacitor in a bi‑polarized, surface‑mount package. It provides 33 µF capacitance at a 10 V rating in a compact φ6.3 × 5.4 mm SMD can, packaged for embossed carrier taping and compatible with automatic placement.

Designed for high‑density PCBs and AEC‑Q200 qualified applications, this component targets automotive and robust embedded power designs that require reliable ripple filtering and AC‑capable capacitance across an operating range of −40 °C to +85 °C.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance with a 10 V rated voltage and ±20% tolerance for predictable bulk and decoupling behavior.
• Bi‑Polarized Construction — Bi‑polar design supports AC or polarity‑inverting conditions and endurance testing with polarity inversion performed during qualification.
• Compact SMD Package — φ6.3 × 5.4 mm radial can in a chip‑type SMD footprint; surface mount land size 6.6 × 6.6 mm for space‑constrained board designs.
• Automated Assembly Ready — Supplied on embossed carrier taping suitable for automatic mounting machines, enabling efficient pick‑and‑place handling.
• Electrical Performance — Low‑frequency ripple current 41 mA at 120 Hz and high‑frequency ripple current 61.5 mA at 10 kHz, with tan δ = 0.20 (10 V, 120 Hz) and leakage current of 16.5 µA.
• Thermal & Reliability — Rated for operation from −40 °C to +85 °C with a specified lifetime of 1000 hours at 85 °C; endurance and shelf‑life characteristics are defined per the UWP series specifications.
• AEC‑Q200 Qualified — Listed with AEC‑Q200 rating, supporting use in automotive electronic designs that require component level qualification.
• RoHS Compliant — Conforms to RoHS requirements for restricted substances.

Typical Applications

• Automotive Electronics — Suitable for vehicle electronic modules and control units that require AEC‑Q200 qualified capacitors for decoupling and AC‑capable circuits.
• High‑Density Surface‑Mount PCBs — Designed for compact board layouts where space is limited and automated placement is used.
• Power Rail Filtering — Used for ripple smoothing and local energy storage on low‑voltage rails across a wide temperature range.

Unique Advantages

• Bi‑polar capability: Supports AC operation and polarity inversion scenarios, giving designers flexibility in AC coupling and signal‑handling circuits.
• AEC‑Q200 qualification: Enables selection for automotive systems that require qualified components for improved reliability under vehicle conditions.
• Automated assembly friendly: Embossed carrier taping and chip‑type SMD form factor simplify high‑volume manufacturing and placement on automated lines.
• Compact footprint with defined land pattern: Small φ6.3 × 5.4 mm package and recommended land size (6.6 × 6.6 mm) help optimize board area without sacrificing capacitance.
• Clear performance data: Specified ripple currents (41 mA @120 Hz, 61.5 mA @10 kHz), tan δ, and leakage current (16.5 µA) provide quantifiable parameters for power‑integrity design decisions.
• Temperature endurance: Rated for −40 °C to +85 °C with a 1000‑hour endurance at 85 °C, supporting designs that require stable behavior over time and temperature.

Why Choose UWP1A330MCL1GB?

The UWP1A330MCL1GB combines a bi‑polar aluminum electrolytic topology with a compact surface‑mount can and AEC‑Q200 qualification, making it well suited for automotive and other demanding embedded power applications. Its defined ripple current, low tan δ, and controlled leakage current let engineers size bulk and filtering capacitors with confidence.

This part is appropriate for designers seeking a proven SMD electrolytic solution for high‑density PCBs, automated assembly, and applications requiring long‑term thermal endurance and industry qualification.

To request a quote or submit an inquiry about availability and volume pricing for UWP1A330MCL1GB, please contact our sales team through the standard quotation request channels.