UWP1C330MCL1GB

The UWP1C330MCL1GB is a surface-mount, bi-polarized aluminum electrolytic chip capacitor designed for high-density printed circuit boards. It delivers 33 µF capacitance at a 16 V rating in a compact φ6.3×5.4 mm chip package and is supplied in embossed carrier tape for automated assembly.

Engineered for reliability, the part is AEC-Q200 qualified and RoHS compliant, with an operating temperature range of −40°C to +85°C and a documented 1000-hour endurance at 85°C. Its electrical characteristics—low leakage, defined tan δ and rated ripple currents—support robust performance in demanding electronic and automotive applications.

Key Features

• Capacitance & Voltage: 33 µF rated capacitance at 16 V, with capacitance tolerance of ±20% (120 Hz, 20°C).
• Bi‑Polarized Construction: Bipolar design enables AC-capable operation where non-polar behavior is required.
• Low Leakage & Loss: Leakage current specified at 26.4 µA (20°C, after 2 minutes); tan δ of 0.17 at 120 Hz, 20°C for predictable loss characteristics.
• Ripple Performance: Rated ripple current 49 mArms at 85°C / 120 Hz and 73.5 mA at 10 kHz, with frequency coefficients provided for other operating frequencies.
• Thermal & Endurance Specs: Operating temperature −40°C to +85°C; endurance specification of 1000 hours at 85°C with polarity inversion test conditions per datasheet.
• Automotive-Grade Reliability: AEC-Q200 qualification confirms suitability for automotive electronic module use.
• Compact SMD Package: Chip-type radial can SMD in φ6.3×5.4 mm case size with recommended land pattern 6.6 × 6.6 mm, optimized for space-constrained layouts.
• Production & Assembly Ready: Supplied in embossed carrier taping for compatibility with automatic pick-and-place and high-volume assembly.

Typical Applications

• Automotive Electronic Modules: Ideal for in-vehicle control units and modules that require AEC-Q200 qualified components with stable ripple and leakage performance.
• High‑Density PCB Designs: Compact chip package supports space-limited power and decoupling applications on densely populated boards.
• AC‑Capable Circuits: Bipolarized construction supports AC-coupling or circuits where polarity reversals may occur.
• Automated Assembly Lines: Embossed carrier tape packaging enables efficient integration into automated SMT production flows.

Unique Advantages

• AEC-Q200 Qualified Reliability: Meets automotive-grade qualification for designs that demand proven component robustness.
• Compact Footprint with SMD Convenience: φ6.3×5.4 mm chip form factor and SMD package reduce board real estate while simplifying placement.
• Clear Electrical Specifications: Defined leakage, tan δ, and ripple current ratings provide predictable behavior for power and filtering designs.
• Endurance and Thermal Stability: 1000-hour endurance at 85°C and −40°C to +85°C operating range support sustained performance across temperature extremes.
• Production-Ready Packaging: Embossed carrier taping supports high-volume automated assembly and consistent part handling.
• RoHS Compliance: Conforms to RoHS (2011/65/EU, (EU)2015/863) to meet regulatory requirements for lead-free assemblies.

Why Choose UWP1C330MCL1GB?

The UWP1C330MCL1GB combines a compact SMD chip footprint with bi-polarized aluminum electrolytic performance, making it a practical choice for designers needing AC-capable decoupling and filtering in space-constrained electronic and automotive modules. Its combination of clearly specified leakage, loss tangent, ripple current ratings and 1000-hour endurance at 85°C helps engineers predict in-field behavior and design for longevity.

With AEC-Q200 qualification, embossed carrier taping for automated placement, and RoHS compliance, this part is positioned for high-volume manufacturing environments and applications where reliability and assembly efficiency are essential.

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