UWR1H100MCL1GB

The UWR1H100MCL1GB is a compact chip-type aluminum electrolytic capacitor designed for surface mounting on high-density printed‑circuit boards. It delivers 10 µF capacitance at a 50 V rating in a small radial can SMD package optimized for automated carrier‑tape assembly.

Engineered for applications requiring robust electrolytic filtering in demanding environments, this part is AEC‑Q200 compliant and RoHS‑compatible, with a rated operating range of −40 °C to +85 °C and a specified load life of 2000 hours at 85 °C.

Key Features

• Capacitance & Voltage — 10 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance, suitable for bulk decoupling and smoothing on DC rails.
• Compact Chip Profile — Chip‑type construction with a 5.5 mm height profile and size dimensions L: 5.4 × D: 5 mm, enabling use on high‑density SMD assemblies.
• Surface Mount, Tape‑Feed Compatible — Radial can SMD package designed for surface mounting and compatible with automatic mounting machines fed by carrier tape.
• Wide Temperature Range — Rated for operation from −40 °C to +85 °C to match typical electronic system environmental requirements.
• Automotive Reliability — AEC‑Q200 rated for applications requiring established automotive qualification standards.
• Endurance & Stability — Load life specified at 2000 hours at 85 °C; leakage current specification after 2 minutes ≤ 0.01CV or 3 µA (whichever is greater).
• Ripple Performance — Rated ripple current of 30 mA at 120 Hz and 45 mA at 10 kHz for stabilized performance under real‑world AC stress.
• RoHS Compliant — Meets RoHS directive requirements (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive control modules — Bulk filtering and power stabilization in modules that require AEC‑Q200 components and broad temperature operation.
• High‑density PCB power rails — Space-efficient SMD solution for decoupling and smoothing in compact assemblies.
• Sensor and interface electronics — Local energy storage and noise suppression for sensor front‑ends and signal conditioning circuits.

Unique Advantages

• Space‑efficient SMD form factor: Chip‑type, small footprint and low profile enable placement in high‑density designs without sacrificing capacitance.
• Automated assembly ready: Carrier‑tape compatibility simplifies pick‑and‑place processing and reduces manual handling in production.
• Qualified reliability: AEC‑Q200 compliance and a 2000‑hour load‑life rating at 85 °C provide verifiable endurance for regulated applications.
• Predictable leakage behavior: Clear leakage current limits (≤ 0.01CV or 3 µA after 2 minutes at 20 °C) aid in power‑budget and tolerance planning.
• RoHS compliance: Lead‑free materials support regulatory requirements for many commercial and automotive programs.

Why Choose UWR1H100MCL1GB?

The UWR1H100MCL1GB combines a compact chip‑type SMD package with AEC‑Q200 qualification and defined endurance at elevated temperature, making it suitable for engineers specifying electrolytic bulk capacitance in space‑constrained, production‑assembled electronics. Its clear electrical parameters—10 µF at 50 V, defined ripple current ratings, and leakage limits—enable straightforward integration into power‑conditioning and decoupling designs.

This part is a fit for designs where automotive‑grade reliability, tape‑feed assembly, and compact size are priorities. The combination of rated performance and RoHS compliance supports medium‑ to long‑lifecycle programs that require documented component behavior under temperature and ripple stress.

If you would like pricing or availability information, or to request a formal quote for UWR1H100MCL1GB, please submit a request and our team will respond with the next steps.