UWR1H220MCL1GB

The UWR1H220MCL1GB is a chip-type aluminum electrolytic capacitor from Nichicon’s UWR series, rated at 22 µF and 50 V. It is designed for surface mounting on high-density PCBs and for use in automotive electronics where AEC‑Q200 qualification and durability are required.

With a compact chip form factor (5.5 mm height) and carrier-tape compatibility for automated placement, this capacitor delivers board-level power decoupling and filtering in confined assemblies while meeting RoHS requirements.

Key Features

• Capacitance & Voltage — 22 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance for predictable energy storage and filtering performance.
• Chip-Type SMD Package — Chip form factor intended for surface mounting on high-density PC boards; compatible with automatic mounting machines fed with carrier tape.
• Compact Dimensions — Small footprint (L: 5.4 × D: 6.3 mm) and a 5.5 mm chip height to save board space in compact electronic modules.
• Automotive-Grade Reliability — AEC‑Q200 compliant and specified for automotive applications with load life of 2000 hours at 85 °C for endurance under elevated temperature stress.
• Operating Range — Rated for operation from −40 °C to +85 °C to cover typical automotive ambient conditions.
• Leakage and Loss Characteristics — Leakage current limited per datasheet (≤0.01CV or 3 µA after 2 minutes at 20 °C) and specified tan δ values for stable behavior at 120 Hz.
• Ripple Handling — Specified ripple current characteristics: 43 mA at 120 Hz and 64.5 mA at 10 kHz to support power-supply decoupling tasks.
• RoHS Compliant — Conforms to RoHS directives (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronics — Suited for automotive modules and control units where AEC‑Q200 qualification and thermal endurance are required.
• High-density PCB assemblies — Designed for surface mounting on compact, densely populated boards where board space and low-profile parts are important.
• Automated assembly lines — Carrier-tape compatibility enables efficient placement on automated SMT lines for high-volume production.

Unique Advantages

• Automotive-ready qualification — AEC‑Q200 compliance provides documented reliability criteria beneficial for automotive development and validation processes.
• Proven endurance at elevated temperature — 2000 hours at 85 °C endurance rating supports designs that must withstand prolonged thermal stress.
• Compact SMD form factor — Small dimensions (5.4 × 6.3 mm footprint and 5.5 mm height) help reduce BOM footprint and enable denser board layouts.
• Manufacturing-friendly — Carrier-tape compatibility and chip package type streamline automated placement and assembly throughput.
• Measured leakage and ripple specs — Defined leakage current limits and ripple current ratings offer predictable behavior for power filtering and decoupling applications.
• RoHS compliance — Conforms to modern environmental regulations for use in commercial and regulated markets.

Why Choose UWR1H220MCL1GB?

UWR1H220MCL1GB combines a compact, surface-mount chip package with automotive-grade qualification and defined endurance, making it a solid choice for designs that require stable filtering and decoupling in space-constrained, high-reliability environments. Its specified ripple handling, leakage limits, and temperature range support consistent performance across typical automotive operating conditions.

This capacitor is appropriate for engineers and procurement teams specifying components for automotive modules and other compact assemblies where AEC‑Q200 compliance, automated assembly compatibility, and RoHS conformity are important selection criteria.

If you would like pricing, availability, or technical information for UWR1H220MCL1GB, request a quote or contact sales to submit a quote request and discuss lead times and application support.