UWT0G331MCL1GS

The UWT0G331MCL1GS is a Nichicon UWT series aluminum electrolytic chip capacitor designed for surface-mount installation on high-density printed circuit boards. It delivers 330 µF capacitance at a 4 V rating in a compact chip-style can and is supplied in embossed carrier taping for automated placement.

Engineered for wide temperature operation from −55°C to +105°C and AEC-Q200 qualification, this part targets applications that require reliable, high-capacitance SMD electrolytic performance with defined endurance and ripple-handling characteristics.

Key Features

• Capacitance and Voltage — 330 µF nominal capacitance with a rated voltage of 4 V and capacitance tolerance of ±20% (120 Hz, 20°C).
• Wide Temperature Range — Operating temperature range from −55°C to +105°C, supporting use across broad thermal environments.
• Endurance — Rated life of 1000 hours at 105°C with specified limits for capacitance change, tan δ, and leakage current after recovery to 20°C.
• Ripple Current Capability — Low-frequency ripple current of 105 mA at 120 Hz and high-frequency ripple current of 157.5 mA at 10 kHz, suitable for decoupling and smoothing roles within its current rating.
• Leakage Current — Specified leakage current of 13.2 µA (measured per specified conditions), supporting predictable standby and bias behavior.
• Compact SMD Package — Chip-type radial can SMD with dimensions φ6.3 × 7.7 mm (L × D) and recommended land size 6.6 × 6.6 mm for high-density board layouts.
• Manufacturing & Compliance — Supplied in embossed carrier taping for automatic mounting; RoHS compliant and AEC-Q200 qualified.

Typical Applications

• Automotive Electronics — Suitable for automotive modules where AEC-Q200 qualification and wide temperature range are required.
• High-density PCB Designs — Chip-type surface-mount format intended for compact power and filtering use on space-constrained boards.
• Automated Assembly — Embossed carrier taping enables placement by automatic mounting machines in production lines.

Unique Advantages

• Wide operating temperature range: −55°C to +105°C supports consistent performance across harsh thermal conditions.
• High capacitance in a small SMD footprint: 330 µF in a φ6.3 × 7.7 mm package helps reduce board area compared with larger through-hole options.
• Defined endurance specification: 1000 hours at 105°C provides clear lifetime expectations for thermal stress environments.
• Measurable ripple handling: Specified low- and high-frequency ripple currents (105 mA at 120 Hz, 157.5 mA at 10 kHz) allow designers to match the part to system ripple requirements.
• Production-friendly packaging: Embossed carrier taping simplifies high-volume automated placement and inventory handling.
• Industry qualification: AEC-Q200 qualification and RoHS compliance support regulated and reliability-focused designs.

Why Choose UWT0G331MCL1GS?

The UWT0G331MCL1GS combines high capacitance, a compact chip-style SMD package, and a wide −55°C to +105°C operating range with defined endurance and ripple specifications. Its AEC-Q200 qualification and embossed carrier taping make it a practical choice for production assemblies that require predictable electrolytic performance under thermal and mechanical constraints.

This part is well suited to engineers and purchasers looking for a high-capacitance surface-mount electrolytic solution for regulated industries and high-density boards where lifecycle definition, automated placement, and environmental compliance are important.

Request a quote or contact sales to discuss availability, lead times, and to submit quantity requirements for the UWT0G331MCL1GS.