UWT0J101MCL1GB

The UWT0J101MCL1GB is a Nichicon UWT series aluminum electrolytic chip capacitor in a compact surface-mount can package. It delivers 100 µF at a rated voltage of 6.3 V with polarized construction and is designed for high-density PCB assemblies and automated carrier-tape mounting.

Engineered for demanding temperature environments and qualified to AEC-Q200, this part targets applications that require RoHS-compliant components with defined endurance and ripple performance across a wide operating temperature range.

Key Features

• Electrical Rating — 100 µF capacitance with a 6.3 V rated voltage and polarization; capacitance tolerance ±20% (120 Hz, 20°C).
• Wide Temperature Range — Specified operation from -55°C to +105°C for applications that encounter extreme ambient conditions.
• High-Temperature Endurance — Endurance specified as 1000 hours at 105°C with capacitance change and leakage requirements defined for post-test performance.
• Ripple Performance — Low-frequency ripple current: 60 mA at 120 Hz; high-frequency ripple current: 90 mA at 10 kHz.
• Low-Temperature Stability — Impedance ratios for the 6.3 V rating: Z(-25°C)/Z(+20°C) = 4 and Z(-40°C)/Z(+20°C) = 8, useful for cold-start or low-temperature operation planning.
• Reliability & Compliance — AEC-Q200 qualified and RoHS (2011/65/EU, (EU)2015/863) compliant; leakage current spec: after 2 minutes at rated voltage ≤ 0.01CV or 3 µA (whichever is greater).
• Package & Assembly — Chip-type SMD can with physical size L: 5.4 × D: 6.3 mm, surface mount land size 6.6 × 6.6 mm; suitable for automatic mounting machines fed with carrier tape.
• Soldering and Shelf Characteristics — Resistance to soldering heat: hot plate 250°C for 30 seconds with defined post-test characteristic limits; shelf life tested at 105°C for 1000 hours.

Typical Applications

• Automotive electronics — For electronic modules where AEC-Q200 qualification, wide temperature capability (-55°C to +105°C) and RoHS compliance are required.
• High-density surface-mount assemblies — Compact chip package sizes support space-constrained board designs and dense component placement.
• Automated assembly processes — Carrier-tape compatibility and SMD form factor enable efficient pick-and-place production lines.

Unique Advantages

• Wide operating temperature window — Supports applications from -55°C to +105°C, reducing the need for temperature-specific alternate parts.
• AEC-Q200 qualification — Provides a documented reliability baseline for automotive-grade designs and other high-reliability systems.
• Compact SMD can package — Enables placement on high-density PCBs while maintaining substantial capacitance in a small footprint.
• Defined high-temperature endurance — 1000 hours at 105°C with specified limits for capacitance, tan δ and leakage current delivers predictable long-term behavior under stress.
• Assembly-friendly — Designed for carrier-tape feed and automated mounting, helping streamline manufacturing and reduce handling variability.
• Regulatory compliance — RoHS conformant, aligning with environmental requirements for many markets and programs.

Why Choose UWT0J101MCL1GB?

UWT0J101MCL1GB positions itself as a reliable, compact electrolytic solution for designs that demand wide temperature tolerance, automated assembly compatibility, and AEC-Q200-level qualification. Its combination of 100 µF capacitance at 6.3 V, defined ripple and leakage specifications, and verified high-temperature endurance makes it suitable for engineering teams specifying robust SMD capacitors for long-life applications.

This part is well suited to teams designing for automotive environments or other applications that require RoHS compliance, predictable high-temperature performance, and space-efficient surface-mount components. Choosing this capacitor helps maintain design consistency across temperature extremes while simplifying procurement and assembly integration.

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