UWT0J221MCL1GB

The UWT0J221MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It delivers 220 µF capacitance at a 6.3 V rating with a wide operating temperature range of −55°C to 105°C and is AEC-Q200 qualified for demanding environments.

Engineered for automated assembly, RoHS-compliant and specified for a 1000 hour lifetime at 105°C, this capacitor is suited to designs that require temperature resilience, board-level integration, and industry qualification.

Key Features

• Capacitance & Voltage — 220 µF nominal capacitance with a 6.3 V rated voltage and ±20% tolerance (at 120 Hz, 20°C), suitable for bulk decoupling and energy storage at low voltage rails.
• Wide Temperature Range — Specified operation from −55°C to 105°C, supporting applications that must tolerate extreme ambient conditions.
• AEC-Q200 Qualified — Meets AEC-Q200 qualification requirements, indicating suitability for applications requiring that industry qualification.
• Endurance & Lifetime — Rated for 1000 hours at 105°C with defined endurance limits for capacitance change, tan δ and leakage current after the test.
• SMD Chip Package — Chip-type radial can designed for surface-mount assembly; physical size L: 5.4 × D: 8 mm with recommended land size L: 8.3 × W: 8.3 mm for PCB layout.
• Assembly Ready — Applicable to automatic mounting machines fed with carrier tape for high-volume production.
• Ripple Performance — Specified ripple current: 102 mA at 120 Hz and 153 mA at 10 kHz, enabling evaluation against application ripple requirements.
• Low Leakage Specification — Leakage current after 2 minutes at rated voltage and 20°C is specified as not more than 0.01CV or 3 µA (whichever is greater), useful for low-leakage designs.
• Environmental Compliance — Compliant with RoHS directive (2011/65/EU,(EU)2015/863).

Typical Applications

• Automotive Electronics — Used in vehicle electronics where AEC-Q200 qualification and a wide temperature range are required for reliable board-level capacitance.
• Power Filtering and Decoupling — Employed on low-voltage power rails for bulk filtering and smoothing where 220 µF at 6.3 V is specified.
• High-Density PCB Designs — Chip-type SMD form factor supports surface mounting on compact, densely populated boards and automated assembly processes.

Unique Advantages

• Qualification for Demanding Environments: AEC-Q200 qualification provides a verified baseline for use in applications that require industry-recognized component qualification.
• Wide Operating Temperature Margin: −55°C to 105°C rating ensures performance across a broad range of ambient and system temperatures.
• Production-Ready Package: Chip-type SMD design and carrier-tape compatibility simplify automated placement and high-volume manufacturing workflows.
• Defined Reliability Metrics: 1000 hour endurance at 105°C with specified limits on capacitance, tan δ and leakage current supports reliability planning and lifetime calculations.
• Controlled Leakage: Leakage current limit (0.01CV or 3 µA after 2 minutes) aids low-leakage power designs and energy-sensitive applications.
• Regulatory Compliance: RoHS compliance supports designs targeting markets with environmental substance restrictions.

Why Choose UWT0J221MCL1GB?

UWT0J221MCL1GB combines a chip-type SMD package with a high-capacitance 220 µF element and a 6.3 V rating, delivering board-level energy storage in a footprint optimized for automated assembly. Its −55°C to 105°C operating range, AEC-Q200 qualification and 1000 hour endurance at 105°C make it a practical choice where temperature resilience and industry qualification are required.

This part is ideal for engineers specifying capacitors for automotive and other demanding applications that need verifiable endurance, controlled leakage, and surface-mount compatibility to streamline BOMs and manufacturing flow while meeting regulatory requirements.

To request a quote or discuss volume pricing and availability for UWT0J221MCL1GB, please contact our sales team or submit a quote request through the usual procurement channels.