UWT0J330MCL1GB

The UWT0J330MCL1GB is a chip-type aluminum electrolytic capacitor engineered for surface-mount, high-density PCB assemblies. It delivers 33 µF capacitance at a 6.3 V rating and is optimized for applications that require reliable operation across a wide temperature range from −55 °C to +105 °C.

Designed for automated production, this part supports carrier-tape feed mounting and carries AEC-Q200 qualification and RoHS compliance, positioning it for demanding automotive and industrial electronic modules that require compact bulk capacitance and long-term thermal endurance.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance with a 6.3 V rated voltage and tolerance of −20% to +20%.
• Wide Temperature Range — Specified operating range from −55 °C to +105 °C to support extreme-environment operation.
• AEC-Q200 Qualified — Meets AEC-Q200 requirements as indicated in the product data, suitable for automotive-design workflows.
• Long High‑Temperature Lifetime — Endurance specified as 1000 hours at 105 °C with defined post-test limits for capacitance, tan δ and leakage current.
• SMD Chip Package — Radial can, SMD chip type intended for surface mounting on high-density PCBs; package dimensions L: 5.4 × D: 5 mm.
• Assembly-Friendly — Applicable to automatic mounting machines fed with carrier tape; specified surface-mount land size L: 5.3 × W: 5.3 mm.
• Loss & Low‑Temperature Characteristics — tan δ max. 0.30 at 6.3 V (measured at 120 Hz, 20 °C); impedance ratios at low temperatures are provided for the 6.3 V rating (Z(−25 °C)/Z(+20 °C) = 4, Z(−40 °C)/Z(+20 °C) = 8).
• Leakage Current — After 2 minutes at rated voltage and 20 °C, leakage current is specified as not more than 0.01CV or 3 µA, whichever is greater.
• Ripple Current Ratings — Low-frequency ripple current 30 mA at 120 Hz and high-frequency ripple current 45 mA at 10 kHz.
• Environmental Compliance — RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronic modules — Bulk and decoupling capacitance for control modules and power electronics where AEC-Q200 qualification is required.
• High-density surface-mount power circuits — Compact chip form factor for power regulation and local energy storage on dense PCBs.
• Automated assembly production — Carrier-tape compatibility streamlines placement for high-volume, automated manufacturing.

Unique Advantages

• Wide operating temperature range: Ensures reliable capacitance performance from −55 °C to +105 °C for thermal robustness in harsh environments.
• AEC-Q200 qualification: Provides a documented qualification path for automotive designs and reliability-focused applications.
• Compact SMD chip format: Small L: 5.4 × D: 5 mm package and defined land pattern enable space-constrained PCB layouts.
• Designed for automated assembly: Carrier-tape compatibility reduces handling time and integrates with standard pick-and-place processes.
• High-temperature endurance: 1000-hour rating at 105 °C with defined post-test limits supports long-term thermal reliability.
• Measured electrical characteristics: Specified tan δ, impedance ratios at low temperature, and leakage current limits provide verifiable performance metrics for design validation.

Why Choose UWT0J330MCL1GB?

The UWT0J330MCL1GB combines compact SMD packaging with a broad −55 °C to +105 °C operating range and AEC-Q200 qualification to meet the reliability and assembly requirements of automotive and industrial electronic designs. Its endurance specification and clearly defined electrical limits allow engineers to design with predictable long-term behavior under elevated temperature stress.

This capacitor is well suited for designers who need a small, manufacturable aluminum electrolytic solution for surface-mount power and decoupling applications where environmental compliance and automated assembly compatibility are priorities.

Request a quote or submit a pricing inquiry for UWT0J330MCL1GB to receive availability and lead-time information tailored to your production needs.