UWT0J681MNL1GS

The UWT0J681MNL1GS is a chip-type aluminum electrolytic capacitor in the Nichicon UWT series, engineered for surface-mount assembly on high-density PC boards. It combines high capacitance (680 µF) at a 6.3 V rating with a wide operating temperature range from −55 °C to +105 °C.

Designed for automated production (carrier-tape feed) and AEC-Q200 qualification, this polarized SMD can serves applications where wide temperature tolerance, robust endurance and RoHS compliance are required.

Key Features

• Electrical Capacity — 680 µF nominal capacitance at 6.3 V with ±20% tolerance (120 Hz, 20 °C), providing substantial bulk capacitance in a compact SMD package.
• Wide Temperature Range — Rated for −55 °C to +105 °C, supporting designs that must operate across extreme ambient conditions.
• Series Endurance — Endurance specified as 1000 hours at 105 °C; for capacitors ≤16 V (including this 6.3 V part), capacitance change is within ±25% after the endurance test.
• Low-Temperature Stability — Measured impedance ratios for 6.3 V: Z(−25 °C)/Z(+20 °C) = 4 and Z(−40 °C)/Z(+20 °C) = 8, helping predict performance in cold-start conditions.
• Loss and Leakage Characteristics — tan δ (120 Hz, 20 °C) max for 6.3 V is 0.30; leakage current (after 2 minutes at rated voltage, 20 °C) is ≤0.01CV or 3 µA, whichever is greater.
• Ripple Current Capability — 210 mA at 120 Hz and 315 mA at 10 kHz, enabling effective smoothing and decoupling in power circuits within rated limits.
• Surface-Mount Radial Can Package — SMD radial/can construction for high-density PCBs; recommended land pattern 8.3 mm × 8.3 mm and part footprint dimension L: 10 mm × D: 8 mm (1.0 × 0.8 cm).
• Assembly and Process Robustness — Compatible with automatic mounting machines fed by carrier tape; series resistance-to-soldering-heat specification: hot plate at 250 °C for 30 seconds with characteristic retention.
• Compliance & Qualification — RoHS compliant and AEC-Q200 qualified, supporting regulated and automotive-focused designs.

Typical Applications

• Automotive Electronics — Bulk smoothing and decoupling in automotive control modules where AEC-Q200 qualification and −55 °C to +105 °C operation are required.
• Power Supply Modules — Energy storage and output filtering on DC–DC converters and power-management boards mounted on high-density PCBs.
• Industrial and Embedded Systems — Decoupling and bulk capacitance for embedded controllers and industrial electronics that must tolerate wide temperature swings and long endurance stress.

Unique Advantages

• High Bulk Capacitance in an SMD Form — 680 µF at 6.3 V delivers significant energy storage while enabling surface-mount assembly on compact boards.
• Wide Operating Temperature — −55 °C to +105 °C rating allows use across harsh environments without compromising capacitance specs.
• Automated Assembly Ready — Carrier-tape compatibility speeds PCB assembly and reduces handling complexity in high-volume production.
• Qualification for Automotive Use — AEC-Q200 qualification provides an added level of design confidence for vehicle electronics applications.
• Predictable Endurance and Reliability — 1000-hour endurance at 105 °C with defined limits for capacitance, tan δ and leakage current simplifies lifetime planning.
• Regulatory Compliance — RoHS compliance supports designs targeting restricted-substance requirements.

Why Choose UWT0J681MNL1GS?

UWT0J681MNL1GS positions itself as a robust, high-capacitance SMD electrolyte option for engineers who need dependable bulk capacitance with wide-temperature capability and automotive-grade qualification. Its combination of 680 µF at 6.3 V, defined low-temperature impedance behavior, and ripple-current ratings make it suitable for power supply filtering and energy storage on space-constrained, high-density PCBs.

For design teams focused on reliability and manufacturability, this part offers clear, testable endurance and soldering-heat specifications, tape-and-reel assembly readiness, and RoHS/AEC-Q200 credentials that support long-term deployment in regulated and demanding environments.

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