UWT1V330MCL1GB

The UWT1V330MCL1GB is a chip-style aluminum electrolytic capacitor engineered for surface-mount use on high-density PC boards. It provides 33 µF at a 35 V rating, optimized for automated assembly (carrier-tape fed) and long-term operation across a wide temperature range.

Key value comes from its wide operating temperature range (−55°C to +105°C), AEC-Q200 qualification, and RoHS compliance, making it suitable for demanding environments where reliable decoupling and filtering are required in compact SMD form factors.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance with a 35 V rated voltage and ±20% tolerance at 120 Hz, 20°C.
• Wide Temperature Range — Rated for operation from −55°C to +105°C to support designs spanning extreme ambient conditions.
• Reliability & Lifetime — Endurance specified as 1000 hours at 105°C with defined limits for capacitance change, tan δ, and leakage current; shelf life and resistance-to-soldering-heat characteristics are provided in the datasheet.
• AEC-Q200 Qualified — Meets AEC-Q200 qualification requirements, supporting use in qualified automotive electronics applications.
• Surface-Mount, Assembly-Friendly Package — Chip-type radial can SMD package designed for high-density PCBs and compatible with automatic mounting machines fed with carrier tape; case dimensions L: 5.4 × D: 8 mm with recommended land size L: 8.3 × W: 8.3 mm.
• Electrical Performance — Ripple current ratings of 59 mA at 120 Hz and 88.5 mA at 10 kHz; leakage current specified as not more than 0.01CV or 3 µA (whichever is greater) after 2 minutes at 20°C.
• Loss and Low-Temperature Behavior — Tangent of loss angle (tan δ) and impedance ratio performance are specified by rated voltage and temperature to support predictable behavior across operating conditions.
• Environmental Compliance — Compliant to the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Power Electronics — Suited for power decoupling and filtering on automotive boards where AEC-Q200 qualification and wide temperature capability are required.
• High-Density Surface-Mount PCBs — Chip-style form factor and carrier-tape assembly compatibility make it appropriate for compact, automated production of densely populated boards.
• Embedded Modules and Control Units — Provides local energy storage and noise suppression on control and electronic modules operating across a wide temperature range.

Unique Advantages

• Wide operating temperature window: −55°C to +105°C supports designs that must perform in extreme ambient conditions.
• Automotive-grade qualification: AEC-Q200 qualification enables use in automotive electronic applications requiring recognized reliability standards.
• Assembly-ready SMD package: Chip-style radial can designed for automatic mounting (carrier-tape fed), reducing assembly complexity on high-density boards.
• Compact footprint: Small case dimensions and defined land pattern (8.3 × 8.3 mm) help save PCB area while providing useful capacitance and voltage rating.
• Documented endurance and soldering performance: 1000 hours at 105°C endurance and resistance-to-soldering-heat data support predictable life-cycle planning and manufacturing robustness.
• Regulatory compliance: RoHS compliance simplifies environmental compliance for regulated designs.

Why Choose UWT1V330MCL1GB?

The UWT1V330MCL1GB combines a compact chip-style SMD package with automotive-grade qualification and a wide −55°C to +105°C operating range, delivering a reliable decoupling and filtering option for high-density PCBs. Its documented endurance at elevated temperature, controlled leakage characteristics, and assembly-friendly form factor make it well suited to engineering teams designing robust, space-constrained electronic modules.

This part is a practical choice for engineers and procurement teams seeking a qualified, compact aluminum electrolytic capacitor that integrates into automated surface-mount production while meeting environmental and reliability expectations.

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