UWX0G101MCL1GB

The UWX0G101MCL1GB is a chip‑type aluminum electrolytic capacitor designed for surface mounting on high‑density PCBs. It provides 100 µF capacitance at a 4 V rated voltage in a compact chip-style can intended for automated, tape‑fed assembly.

Engineered for applications requiring automotive-grade qualification and extended operating life, this part is AEC‑Q200 compliant, RoHS compliant, and rated for operation from −40 °C to +85 °C with a load life of 2000 hours at 85 °C.

Key Features

• Capacitance & Voltage — 100 µF rated capacitance at 4 V provides bulk energy storage in a compact SMD package.
• Chip‑Type Surface‑Mount Package — Designed as a chip type can for surface mounting on high‑density PC boards; suitable for automated mounting machines fed with carrier tape.
• Automotive‑Grade Reliability — AEC‑Q200 compliance supports use in automotive electronic modules that require that qualification.
• Wide Operating Temperature — Specified for −40 °C to +85 °C operation and endurance of 2000 hours at 85 °C under rated voltage.
• Low Ripple Capability — Rated ripple current of 56 mA at 120 Hz and 84 mA at 10 kHz for smoothing and decoupling duties.
• Controlled Electrical Characteristics — Capacitance tolerance ±20%; leakage current after 2 minutes is specified as not more than 0.01CV or 3 µA (whichever is greater); tan δ (loss) specified for 4 V units.
• Compact Footprint — Nominal package dimensions L: 5.4 × D: 5 mm with recommended land pattern L: 5.3 × W: 5.3 mm for PCB layout.
• Environmental Compliance — Compliant with RoHS directives (2011/65/EU and (EU)2015/863).

Typical Applications

• Automotive Electronics — Suited for automotive control modules and electronic subsystems where AEC‑Q200 qualification is required.
• High‑Density PCB Assemblies — Chip‑type SMD package is intended for compact board designs that require surface mounting.
• Tape‑Fed Automated Assembly — Applicable to automatic placement machines fed with carrier tape for high‑throughput manufacturing.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q200 compliance provides an established qualification path for vehicle electronics and related rigorous applications.
• Compact SMD form factor: Chip‑type can and small nominal dimensions enable dense board layouts without sacrificing capacitance.
• Long endurance at elevated temperature: 2000 hours at 85 °C under rated voltage supports designs that require sustained thermal reliability.
• Manufacturing‑friendly: Compatible with carrier‑tape automated mounting to streamline high‑volume PCB assembly.
• Regulatory compliance: RoHS conformity simplifies environmental compliance in product design and procurement.

Why Choose UWX0G101MCL1GB?

UWX0G101MCL1GB is positioned for engineers who need a compact, surface‑mount aluminum electrolytic capacitor with automotive qualification and defined endurance characteristics. Its 100 µF/4 V rating, controlled electrical parameters, and tape‑feed compatibility make it a practical choice for dense PCB designs and production environments that require AEC‑Q200 level components.

Choose this part when you require a small SMD electrolytic with specified ripple performance, RoHS compliance, and documented endurance at elevated temperature—helping simplify BOM decisions for robust, space‑constrained assemblies.

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