UWX0G331MCL1GB

The UWX0G331MCL1GB is a chip‑type aluminum electrolytic capacitor in a compact surface‑mount can package offering 330 µF capacitance at 4 V. It is designed for high‑density PCB assemblies and is compatible with automatic mounting machines fed by carrier tape.

Engineered for robust operation, this part is AEC‑Q200 compliant and RoHS compliant, rated for operation from -40 °C to 85 °C with a specified load life of 2000 hours at 85 °C. Its footprint and defined ripple current ratings make it suitable for demanding, space‑constrained electronic systems.

Key Features

• Capacitance & Voltage — 330 µF nominal capacitance with a rated voltage of 4 V and tolerance of ±20% for bulk energy storage and decoupling in low‑voltage systems.
• Surface‑Mount Chip Package — Radial, can‑style SMD package with package dimensions L: 5.4 × D: 8 mm and recommended land size L: 8.3 × W: 8.3 mm to support high‑density board layout and automated placement.
• Automated Assembly Ready — Designed for use with carrier tape and compatible with automatic mounting machines to streamline PCB assembly.
• Electrical Endurance — Rated endurance of 2000 hours at 85 °C under applied rated voltage, with capacitance and leakage current specifications defined after life testing.
• Ripple Current Specification — Defined ripple handling of 145 mA at 120 Hz and 217.5 mA at 10 kHz for predictable performance in supply filtering and transient conditions.
• Qualification & Compliance — AEC‑Q200 compliant and RoHS (2011/65/EU,(EU)2015/863) compliant to meet regulated manufacturing and reliability requirements.
• Wide Operating Range — Nominal operating temperature range from -40 °C to 85 °C for use across a variety of environmental conditions.

Typical Applications

• Automotive electronic systems — Suitable for board‑level energy storage and smoothing in automotive modules where AEC‑Q200 qualification is required.
• High‑density PCB assemblies — Compact chip package and defined land pattern allow integration into space‑constrained power and control boards.
• Automated surface‑mount production — Carrier‑tape compatibility simplifies placement in high‑volume, automated assembly lines.

Unique Advantages

• High capacitance in a compact SMD can — 330 µF in a small footprint supports bulk decoupling without large through‑hole components.
• Automotive‑grade reliability — AEC‑Q200 compliance provides a defined qualification baseline for automotive and other demanding applications.
• Defined endurance at elevated temperature — 2000‑hour load life at 85 °C gives designers measurable long‑term performance expectations under stress.
• Engineered for automated assembly — Carrier tape compatibility and standardized land pattern reduce assembly friction and accelerate manufacturing.
• Measured ripple current ratings — Published ripple values at 120 Hz and 10 kHz enable predictable thermal and ripple management in power circuits.
• Regulatory compliance — RoHS compliance helps meet environmental and regulatory requirements for commercial production.

Why Choose UWX0G331MCL1GB?

UWX0G331MCL1GB combines a high nominal capacitance and defined ripple handling in a surface‑mount can package designed for high‑density PCB layouts and automated assembly. With AEC‑Q200 qualification, RoHS compliance, and a specified 2000‑hour load life at 85 °C, it is positioned for designs that require predictable endurance and qualification‑level reliability.

This part is well suited for engineers specifying board‑level energy storage and smoothing in space‑constrained systems, particularly where automotive qualification and robust thermal endurance are required. Its compact footprint and manufacturing compatibility help reduce BOM complexity and support streamlined production.

If you would like pricing, availability, or to request a quote for UWX0G331MCL1GB, please submit an inquiry to receive a formal quote and technical support information.