UWX0J151MCL1GB

The UWX0J151MCL1GB is a chip-type aluminum electrolytic capacitor in the Nichicon UWX series, designed for surface mounting on high-density printed circuit boards. It delivers 150 µF capacitance at a 6.3 V rating in a compact SMD can package, engineered for automated carrier-tape assembly.

Designed for demanding environments, this part offers AEC-Q200 qualification, RoHS compliance, an operating temperature range of −40°C to +85°C, and a rated load life of 2000 hours at 85°C—making it suitable for space-constrained, reliability-focused applications.

Note: This product is scheduled for discontinuation and is not recommended for new designs.

Key Features

• Compact SMD Chip Package — Chip-type aluminum can (SMD) with dimensions L: 5.4 × D: 6.3 mm and designed 5.5 mm height for high-density board layouts.
• Surface-Mount / Assembly Ready — Engineered for surface mounting and compatible with automatic mounting machines fed by carrier tape for efficient high-volume production.
• Electrical Ratings — 150 µF nominal capacitance at 6.3 V with capacitance tolerance ±20% and polarized construction for DC smoothing and decoupling roles.
• Ripple Current — Rated ripple current 71 mA at 120 Hz and 106.5 mA at 10 kHz to support typical power filtering demands in compact designs.
• Temperature and Lifetime — Operating range −40°C to +85°C with an endurance rating of 2000 hours at 85°C under rated voltage.
• Leakage and Loss Characteristics — Leakage current specified as not more than 0.01CV or 3 µA (whichever is greater) after 2 minutes at 20°C; tan δ max 0.26 at 6.3 V (measured at 120 Hz, 20°C).
• Compliance & Reliability — AEC-Q200 rated and RoHS compliant in accordance with 2011/65/EU and (EU)2015/863.
• PCB Land Pattern — Recommended surface-mount land size L: 6.6 × W: 6.6 mm to accommodate placement and soldering.

Typical Applications

• Automotive Electronics — Suitable for automotive subsystems that require components meeting AEC-Q200 reliability and rugged temperature range.
• High-Density PCB Designs — Compact chip package fits tightly spaced boards where board area is constrained and SMD assembly is required.
• Automated Production — Designed for carrier-tape feeding to support automated pick-and-place lines and high-volume manufacturing throughput.

Unique Advantages

• Automotive-Grade Reliability: AEC-Q200 rating and a 2000-hour load life at 85°C provide a predictable reliability baseline for qualified applications.
• Compact Footprint: Small L × D dimensions and a short chip profile enable use in space-sensitive power supply and decoupling locations.
• Assembly Efficiency: Carrier-tape compatibility and surface-mount form factor reduce assembly time and simplify board-level integration.
• Clear Electrical Limits: Published ripple current and leakage specifications allow straightforward thermal and performance margin calculations.
• Regulatory Compliance: RoHS conformity supports applications requiring restricted-substance compliance.

Why Choose UWX0J151MCL1GB?

UWX0J151MCL1GB positions itself as a compact, surface-mount aluminum electrolytic solution for engineers needing AEC-Q200-rated components with defined endurance and thermal performance. Its combination of a small SMD can package, carrier-tape assembly compatibility, and clear electrical specifications makes it a practical option for maintenance and repair in existing automotive and industrial designs.

Because this part includes defined ripple current, leakage, and tan δ parameters, it is straightforward to evaluate in power-conditioning and decoupling roles where space and predictable lifetime are important.

Request a quote or contact sales to discuss availability, lead times, and pricing for UWX0J151MCL1GB.