UWX0J221MCL1GB

The UWX0J221MCL1GB from Nichicon is a surface-mount aluminum electrolytic capacitor in a compact φ8 × 5.4 mm can package designed for high‑density PCBs. It provides 220 µF capacitance at a rated voltage of 6.3 V with polarization and packaged for automatic assembly.

Targeted for automotive and other demanding electronics, the part offers AEC‑Q200 rating, RoHS compliance, and an endurance rating of 2000 hours at 85°C. Key measured parameters include low-frequency and high-frequency ripple current ratings, low leakage, and specified dissipation factor at 120 Hz.

Key Features

• Capacitance & Voltage — 220 µF nominal capacitance with tolerance ±20% and a rated voltage of 6.3 V.
• Small SMD Can Package — Compact radial, can‑style SMD (φ8 × 5.4 mm) designed for placement on high‑density PC boards; surface mount land size 8.3 × 8.3 mm.
• Measured Loss Angle (tan δ) — tanδ 0.26 measured at 20°C, 120 Hz, providing a specified dissipation characteristic for filtering and decoupling applications.
• Ripple Current Capability — Low-frequency ripple current 110 mA at 120 Hz and high-frequency ripple current 165 mA at 10 kHz for smoothing and decoupling under AC ripple conditions.
• Low Leakage — Specified leakage current of 13.86 µA, suitable for applications where minimal DC leakage is required.
• Endurance & Temperature Range — Load life of 2000 hours at 85°C and operating temperature range −40°C to 85°C.
• Automotive Grade & Compliance — AEC‑Q200 rated and RoHS compliant; supplied in embossed carrier taping for automated mounting.
• Product Status — End Of Life (scheduled for discontinuation); check availability before specifying.

Typical Applications

• Automotive electronic modules — Bulk smoothing and decoupling on high‑density PCBs where AEC‑Q200 qualification and compact SMD packaging are required.
• Power rail stabilization — Local energy storage and ripple suppression on low‑voltage (6.3 V) rails in embedded systems designed for harsh environments.
• High-density PCB assemblies — Surface‑mount can package and embossed carrier taping support automated placement on compact, densely populated boards.

Unique Advantages

• Compact SMD can format — Saves board area while delivering 220 µF of capacitance in a φ8 × 5.4 mm footprint for space‑constrained designs.
• Automotive‑grade reliability — AEC‑Q200 rating plus 2000 hours at 85°C endurance provide predictable behaviour in temperature‑stressed applications.
• Measured performance data — Specified tanδ, leakage current, and ripple current figures enable accurate design tradeoffs for filtering and decoupling.
• Assembly‑friendly packaging — Embossed carrier taping supports automated pick‑and‑place processes to streamline manufacturing.
• Regulatory compliance — RoHS compliant construction for designs that require restricted‑substance conformance.

Why Choose UWX0J221MCL1GB?

Nichicon’s UWX0J221MCL1GB combines a compact surface‑mount can package with quantified electrical characteristics—220 µF at 6.3 V, defined tanδ, leakage, and ripple current ratings—making it suitable for engineers specifying bulk decoupling and smoothing capacitors for automotive and other temperature‑challenged electronics. The part’s AEC‑Q200 rating and 2000 h endurance at 85°C support use in designs requiring predictable lifetime performance.

Because this capacitor is supplied in embossed carrier taping and is RoHS compliant, it integrates into automated assembly flows while meeting environmental restrictions. Verify current stock and lead times before design finalization due to the part’s End Of Life status.

Request a quote or submit a quote request to check pricing and available inventory for UWX0J221MCL1GB and to confirm lead times given the product’s End Of Life status.