UWX0J330MCL1GB

The UWX0J330MCL1GB is a Nichicon UWX series aluminum electrolytic chip capacitor in a surface-mount, chip-type can package. It provides 33 µF capacitance at a 6.3 V rating and is designed for mounting on high-density PC boards and automated assembly fed from embossed carrier tape.

This part offers defined performance characteristics including 0.26 tanδ (20°C, 120 Hz), low leakage current, specified ripple current, and a 2000-hour load life at 85°C. It is RoHS compliant and AEC-Q200 compliant. Note: this product is listed as End of Life / Discontinued.

Key Features

• Capacitance & Voltage — 33 µF rated capacitance at 6.3 V provides bulk energy storage in a compact SMD can.
• Tolerance & Polarization — ±20% capacitance tolerance at 120 Hz, 20°C; polarized electrolytic construction.
• Frequency and Loss — tanδ 0.26 measured at 20°C and 120 Hz, enabling predictable AC loss characteristics for design verification.
• Ripple Current — Rated ripple current of 37 mA at 120 Hz and 55.5 mA at 10 kHz for defined ripple-handling capability.
• Leakage Current — Specified leakage current of up to 3 µA after 2 minutes at rated voltage and 20°C (or 0.01CV, whichever is greater).
• Reliability & Life — Load life of 2000 hours at 85°C with defined endurance limits for capacitance, tanδ and leakage current.
• Operating Range — Rated for operation from –40°C to +85°C.
• Package & Mounting — Chip-type radial can SMD, size L: 5.4 × D: 5 mm (φ5 × 5.4L); supplied in embossed carrier taping for automated pick-and-place.
• Standards Compliance — RoHS compliant and AEC-Q200 compliant as specified.

Typical Applications

• Automotive electronics — Suitable for surface-mount capacitor functions in automotive electronic modules where AEC-Q200 qualification is required.
• High-density PCB assemblies — Chip-type can design and embossed carrier taping facilitate placement on tightly packed boards using automated assembly.
• Power filtering on compact boards — Provides bulk capacitance and ripple-handling in small SMD footprints for localized decoupling and smoothing tasks.

Unique Advantages

• AEC-Q200 compliance: Provides a documented qualification level useful for designs requiring automotive-grade component screening.
• Compact SMD can package: φ5 × 5.4L size delivers 33 µF in a small footprint to save board space on dense designs.
• Defined ripple and loss specs: Published ripple currents and tanδ value allow designers to calculate thermal and AC performance precisely.
• Long elevated-temperature life: 2000 hours at 85°C gives a clear endurance baseline for thermal stress planning.
• Automation-friendly supply: Embossed carrier taping supports high-volume pick-and-place assembly workflows.
• Low leakage: Specified leakage current behavior (3 µA threshold) aids low-power and bias-stability considerations.

Why Choose UWX0J330MCL1GB?

UWX0J330MCL1GB is positioned as a compact, surface-mount aluminum electrolytic solution with clear electrical and reliability specifications suitable for automotive and high-density PCB applications. Its combination of 33 µF capacitance, defined tanδ and ripple current ratings, plus AEC-Q200 and RoHS compliance, supports designs that require traceable component behavior and automated assembly readiness.

This part is appropriate for engineers and procurement teams looking for a documented SMD electrolytic capacitor option for controlled thermal environments and automated manufacturing. Please note the product is listed as End of Life / Discontinued; availability should be confirmed before finalizing production designs.

For pricing, availability and to request a quote or discuss remaining stock and support options, please contact sales or request a formal quote from Nichicon.