UWX0J331MCL1GB

The UWX0J331MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It provides 330 µF capacitance at a 6.3 V rating in a compact SMD radial can package intended for automated placement (carrier tape feed).

Targeted for automotive and industrial board-level power applications, this part offers AEC‑Q200 qualification, RoHS compliance, and a rated load life of 2000 hours at 85°C for reliability in temperature-stressed environments.

Key Features

• Capacitance & Voltage — 330 µF nominal capacitance with a 6.3 V rated voltage and ±20% tolerance, suitable for bulk decoupling and energy storage at low-voltage rails.
• Chip SMD Package — Chip-type, radial can SMD package with dimensions L: 5.4 × D: 8 mm and a 5.5 mm chip height designation; surface-mount land size L: 8.3 × W: 8.3 mm for high-density layouts.
• Thermal Range — Operating temperature range from −40°C to +85°C, supporting a wide range of board-level environments.
• Reliability / Life — Load life specification of 2000 hours at 85°C, validated for endurance under rated voltage stress.
• Ripple Current Ratings — Specified ripple handling of 170 mA at 120 Hz and 255 mA at 10 kHz to address both low- and high-frequency ripple on power rails.
• Automotive Qualification & Compliance — AEC‑Q200 rated and RoHS compliant (2011/65/EU, (EU)2015/863), aligning with automotive-grade part requirements and environmental directives.
• Assembly Compatibility — Designed for surface mounting on boards and applicable to automatic mounting machines fed with carrier tape to support automated assembly processes.
• Polarized Electrolytic — Polarized device; observe polarity in board placement and circuit design.

Typical Applications

• Automotive Electronics — Board-level smoothing and bulk energy storage in vehicle control modules where AEC‑Q200 qualification and −40°C to +85°C operation are required.
• Power Supply Filtering — Decoupling and ripple suppression on low-voltage DC rails in embedded power subsystems, leveraging the 330 µF capacitance and specified ripple current ratings.
• High‑Density PCB Designs — Surface-mount chip package suited for compact, automated assembly on space-constrained boards that require reliable electrolytic capacitance.

Unique Advantages

• Automotive-Grade Reliability — AEC‑Q200 rating and a 2000-hour load life at 85°C provide documented endurance for demanding applications.
• High Bulk Capacitance in a Compact SMD Form — 330 µF at 6.3 V in a small L: 5.4 × D: 8 mm footprint reduces board area compared to larger can types.
• Dual-Frequency Ripple Capability — Ripple current specifications at both 120 Hz and 10 kHz support filtering across low and high-frequency noise sources.
• Assembly-Friendly Packaging — Designed for carrier-tape feeding and automated placement to streamline high-volume manufacturing.
• Regulatory and Environmental Compliance — RoHS-compliant materials meet current environmental directive requirements.

Why Choose UWX0J331MCL1GB?

The UWX0J331MCL1GB offers a practical combination of high bulk capacitance, automotive qualification, and surface-mount convenience for designs that require reliable power decoupling and energy storage on compact PCBs. Its specified ripple current ratings and 2000‑hour life at 85°C make it suitable for temperature-stressed and mission-critical board-level power applications.

This part is appropriate for engineering and procurement teams specifying AEC‑Q200‑rated SMD electrolytic capacitors where automated assembly and RoHS compliance are required.

Please request a quote or submit an availability inquiry for UWX0J331MCL1GB to discuss pricing and lead time.