UWX1A560MCL1GB

The UWX1A560MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface-mount use on high-density printed circuit boards. It delivers 56 µF capacitance at a 10 V rating with polarized construction suitable for power-decoupling and smoothing in compact assemblies.

Engineered for automated production, the part is compatible with carrier-tape feeding for pick-and-place assembly and offers a rated load life of 2000 hours at 85°C. The device is RoHS compliant (2011/65/EU, (EU)2015/863) and AEC-Q200 listed. This product is scheduled to be discontinued and is not recommended for new designs.

Key Features

• Electrical: 56 µF, 10 V — Rated capacitance of 56 µF with a 10 V working voltage and polarization for DC smoothing and decoupling tasks. Tolerance is ±20% at 120 Hz, 20°C.
• Surface-Mount Chip Package — Chip-type, can-style SMD package intended for high-density PCB layouts and automated carrier-tape mounting.
• Reliability & Endurance — Load life specified at 2000 hours when operated at 85°C under rated voltage; leakage current and tan δ meet the series endurance criteria after life test.
• Operating Temperature — Specified for operation from −40°C to +85°C, enabling use across a broad thermal range.
• Ripple Performance — Low-frequency ripple current of 57 mA at 120 Hz and high-frequency ripple capability of 85.5 mA at 10 kHz for common decoupling scenarios.
• Compliance — Conforms to the RoHS directive and is AEC-Q200 compliant as specified in the product data.
• Mechanical & PCB Land — Compact dimensions (L: 5.4 × D: 6.3 mm) with recommended surface-mount land size of 6.6 × 6.6 mm for straightforward PCB footprint implementation.

Typical Applications

• Automotive electronics — Suited for power decoupling and smoothing in modules where AEC-Q200 qualification is required.
• Compact power supplies — Local rail decoupling and output filtering in space-constrained DC–DC converters and point-of-load circuits.
• Control and sensor modules — Energy storage and transient suppression for control boards and sensor interfaces on dense PCBs.
• High-density SMT assemblies — Designed for automated, tape-fed mounting in assemblies demanding small, board-level electrolytic solutions.

Unique Advantages

• Automated assembly ready: Carrier-tape compatibility and chip-type SMD packaging streamline pick-and-place production for high-volume builds.
• Long rated life at elevated temperature: 2000-hour load life at 85°C provides predictable endurance for designs operating in warm environments.
• Compact footprint: Small L × D dimensions and a defined SMD land pattern reduce PCB area while maintaining required capacitance.
• Verified ripple capability: Specified ripple currents at both low and high frequencies support filtering across common switching and line-frequency environments.
• Compliance backed: RoHS conformity and AEC-Q200 listing support regulated-market requirements and reliability expectations.

Why Choose UWX1A560MCL1GB?

The UWX1A560MCL1GB combines a compact chip-style SMD package with automotive-grade reliability and verified ripple performance, making it a practical choice for engineers designing dense power and control electronics. Its 56 µF/10 V rating and polarized construction address a wide range of decoupling and smoothing needs in constrained board real estate.

This part is suited for customers who require an AEC-Q200 listed, RoHS-compliant aluminum electrolytic in an automated assembly-friendly form factor. Please note the product is scheduled for discontinuation and therefore is best considered for maintenance, spare-stock, or legacy designs rather than new product introductions.

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