UWX1C100MCL1GB

The UWX1C100MCL1GB is a chip-type aluminum electrolytic capacitor from Nichicon’s UWX series designed for surface mounting on high-density printed circuit boards. It provides a compact SMD solution with a 10 µF capacitance at a 16 V rating, intended for automotive and other demanding electronic modules where AEC-Q200 qualification and RoHS compliance are required.

Engineered for automated assembly, this capacitor supports carrier-tape feeding for pick-and-place equipment and delivers specified endurance under elevated temperature stress for reliable operation in regulated environments.

Key Features

• Capacitance & Voltage — 10 µF nominal capacitance with a 16 V rated voltage; capacitance tolerance ±20% at 120 Hz, 20°C.
• Chip SMD Package — Compact footprint (L: 5.4 × D: 4.0 mm) in a radial, can-style SMD case suitable for high-density PCB layouts.
• Assembly Ready — Designed for surface mounting and compatible with automatic mounting machines fed with carrier tape to streamline production.
• Automotive-Grade Reliability — AEC-Q200 compliant and listed for automotive applications, providing qualification for vehicle electronics.
• Thermal & Lifetime Rating — Operating temperature range −40°C to +85°C with a rated load life of 2000 hours at 85°C.
• Electrical Performance — Polarized aluminum electrolytic construction; leakage current specification and loss-angle characteristics per series datasheet.
• Ripple Current — Specified ripple performance: 23 mA at 120 Hz and 34.5 mA at 10 kHz to help manage AC stress in power circuits.
• Regulatory Compliance — Compliant with the RoHS directive (2011/65/EU, (EU)2015/863) for restricted substances.

Typical Applications

• Automotive electronics modules — Intended for use in automotive electronic assemblies that require AEC-Q200-qualified, surface-mount passives.
• High-density PCB designs — Compact SMD footprint supports space-constrained power and auxiliary circuits on densely populated boards.
• Automated assembly workflows — Carrier-tape compatible package for streamlined pick-and-place processing in volume production.

Unique Advantages

• AEC-Q200 Qualification: Provides a qualification level suited to automotive electronics, supporting reliability expectations for vehicle systems.
• Compact Footprint: Small L × D package helps optimize board space in high-density designs without sacrificing capacitance value.
• Production-Friendly Packaging: Carrier-tape compatibility reduces handling complexity and improves placement accuracy in automated manufacturing.
• Rated Endurance at Elevated Temperature: 2000 hours at 85°C gives a verifiable endurance baseline for thermal stress planning.
• Documented Electrical Limits: Specified leakage current, tan δ, and ripple current figures enable predictable behavior in power-management designs.
• RoHS Compliance: Meets restricted-substance requirements for regulated markets and supply chains.

Why Choose UWX1C100MCL1GB?

The UWX1C100MCL1GB balances compact SMD packaging with automotive-grade qualification and clear electrical specifications, making it a practical choice for engineers designing vehicle electronics and other assemblies that require reliable, qualified passive components. Its carrier-tape compatibility and small footprint simplify integration into automated production lines and high-density PCBs.

This part is suited for projects that prioritize proven endurance at elevated temperatures, traceable performance data for leakage and ripple, and compliance with RoHS and AEC-Q200 requirements from a recognizable manufacturer and series.

Request a quote or submit an inquiry to discuss availability, pricing, and technical details for incorporating the UWX1C100MCL1GB into your design and production plans.