UWX1H2R2MCL1GB

The UWX1H2R2MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It provides 2.2 µF capacitance at a 50 V rating in a compact SMD radial-can package, optimized for automated assembly.

Key attributes include AEC-Q200 compliance, RoHS conformity, a rated operating range of –40 °C to +85 °C, and a demonstrated load life of 2000 hours at 85 °C, making it suitable for demanding electronic assemblies where space and reliability matter.

Key Features

• Capacitance & Voltage — 2.2 µF capacitance with a 50 V rated voltage and tolerance of −20% to +20% for predictable decoupling and smoothing performance.
• Compact SMD Package — Chip-type radial-can SMD package with dimensions L: 5.4 × D: 4 mm and surface mount land size L: 4.3 × W: 4.3 mm for high-density board layouts.
• Mounting & Assembly — Designed for surface mounting and applicable to automatic mounting machines fed with carrier tape to support high-volume assembly.
• Temperature & Endurance — Rated for −40 °C to +85 °C with a load life of 2000 hours at 85 °C, offering stable performance in sustained elevated-temperature conditions.
• Reliability Standards — AEC-Q200 compliant and RoHS compliant, aligning with automotive-grade reliability and environmental regulations.
• Electrical Characteristics — Ripple current capability of 13 mA at 120 Hz and 19.5 mA at 10 kHz; leakage current specified as not more than 0.01CV or 3 µA (whichever is greater) after 2 minutes at 20 °C, per the datasheet.
• Polarized Device — Polarized capacitor construction for appropriate circuit placement and correct polarity handling.

Typical Applications

• Automotive Electronics — Suited for automotive modules where AEC‑Q200 compliance and compact SMD capacitors are required.
• High-Density PCB Designs — Ideal for densely populated boards where a low-profile chip-type electrolytic capacitor is needed to conserve board area.
• Automated Production Lines — Engineered for use with carrier-tape feeding and automatic mounting equipment to streamline assembly.

Unique Advantages

• AEC‑Q200 Compliance: Provides a recognized automotive reliability qualification to support deployment in safety-conscious designs.
• Compact Footprint: Small L: 5.4 × D: 4 mm form factor and defined land pattern simplify layout on space-constrained PCBs.
• Robust Thermal Endurance: 2000-hour load life at 85 °C delivers predictable aging characteristics for thermal-stressed applications.
• Automated Assembly Ready: Carrier-tape compatibility reduces handling and accelerates pick-and-place processes in volume production.
• Clear Electrical Specs: Published ripple current and leakage current values allow designers to size margins and validate thermal performance.
• Standards Compliance: RoHS conformity supports regulatory requirements for lead-free manufacturing.

Why Choose UWX1H2R2MCL1GB?

UWX1H2R2MCL1GB combines a compact chip-style SMD package with automotive-grade reliability and defined endurance characteristics, making it a practical choice for engineers designing compact, production-ready electronic assemblies. Its measurable ripple current, leakage current specification, and clearly documented temperature and lifetime ratings simplify integration and qualification in controlled designs.

This part is well suited for teams focused on high-density board layouts and automated manufacturing, where consistent performance, regulatory compliance, and predictable end-of-life behavior are required.

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