UWX1V100MCL1GB

The UWX1V100MCL1GB is a chip-type aluminum electrolytic capacitor from Nichicon's UWX series, offering 10 µF capacitance at a 35 V rating in a compact surface-mount can package. It is engineered for use on high-density PCBs and is feed-compatible with carrier-tape automatic mounting machines.

Key technical advantages include an operating range from −40 °C to +85 °C, a specified load life of 2000 hours at 85 °C, AEC-Q200 compliance, and RoHS conformity. Note: this product is scheduled to be discontinued and is not recommended for new designs.

Key Features

• Capacitance & Voltage — Nominal 10 µF capacitance with a 35 V rated voltage and ±20% tolerance (measured at 120 Hz, 20 °C).
• Compact Chip Package — Chip-type aluminum can designed for surface mounting on high-density PCBs; case dimensions L: 5.4 × D: 5 mm with surface-mount land size 5.3 × 5.3 mm and chip height ~5.5 mm.
• Surface-mount Assembly — Applicable to automatic mounting machines fed with carrier tape for efficient SMT production.
• Temperature & Lifetime — Operating temperature range −40 °C to +85 °C with a rated load life of 2000 hours at 85 °C.
• Reliability Standards — AEC-Q200 compliant and RoHS directive (2011/65/EU, (EU)2015/863) compliant.
• Leakage & Loss Characteristics — Leakage current after 2 minutes at 20 °C is not more than 0.01CV or 3 µA (whichever is greater); tan δ limits provided per rated voltage.
• Ripple Current — Specified ripple current: 29 mA at 120 Hz and 43.5 mA at 10 kHz for this value.

Typical Applications

• Automotive control modules — AEC-Q200 compliance and −40 °C to +85 °C operating range make it suitable for board-level filtering and decoupling in automotive electronics.
• Compact power filtering — Small chip can package and defined ripple current ratings support bulk/decoupling use on space-constrained power rails.
• High-density SMT assemblies — Designed for automatic tape-fed placement, ideal where automated surface-mount production and tight board real estate are required.

Unique Advantages

• AEC-Q200 compliance: Provides a recognized automotive-grade qualification basis for designs that require enhanced reliability validation.
• Compact footprint: 5.4 × 5 mm case with chip-type form factor reduces board space compared to larger radial parts while retaining aluminum electrolytic capacitance.
• Manufacturing-ready: Carrier-tape compatibility enables straightforward integration into automated SMT assembly lines.
• High-temperature endurance: Rated for 2000 hours at 85 °C, delivering predictable end-of-life characteristics for thermal stress planning.
• Measured electrical limits: Defined leakage current and tan δ specifications allow predictable behavior in precision filtering and decoupling applications.

Why Choose UWX1V100MCL1GB?

UWX1V100MCL1GB offers a compact, surface-mount aluminum electrolytic solution when you need 10 µF at 35 V in a chip-type can. Its defined electrical parameters (leakage current, tan δ, ripple current) combined with AEC-Q200 compliance and RoHS conformity make it suitable for designs that require documented performance and manufacturing compatibility.

This part is appropriate for customers working on space-constrained boards that require automated placement and controlled lifetime behavior at elevated temperatures. For evaluations of remaining stock or to discuss suitability for existing production needs, sales can provide availability and ordering options.

Request a quote or contact sales to discuss availability, lead times, and to obtain pricing or additional technical information for UWX1V100MCL1GB.