UWX1V330MCL1GB
| Part Description |
33 µF 35 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,058 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWX |
| Manufacturer | Nichicon |
| Manufacturing Status | End Of Life |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 33 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 5.5 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 85°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 85°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 93 mA @ 10 kHz | Ripple Current Low Frequency | 62 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.4 x 8 mm | Surface Mount Land Size | 8.3 x 8.3 mm | ||
| Tolerance | -20%~20% | Voltage | 35 V |
Overview of UWX1V330MCL1GB – 33 µF, 35 V Surface-Mount Aluminum Electrolytic Capacitor (Chip Type)
The UWX1V330MCL1GB is a chip-type aluminum electrolytic capacitor in the Nichicon UWX series, specified at 33 µF and 35 V. It is designed for surface mounting on high-density printed circuit boards and supports automated assembly via carrier tape.
Built for applications that require AEC-Q200 compliance and RoHS conformity, this part delivers a compact SMT can package with a specified 2000-hour load life at 85°C, making it suitable for demanding electronic modules in automotive and related markets.
Key Features
- Core Electrical — 33 µF capacitance at a 35 V rated voltage with ±20% tolerance for predictable decoupling and energy storage.
- Package & Mounting — Chip-type radial can SMD in a compact L: 5.4 × D: 8 mm footprint with a surface-mount land size of 8.3 × 8.3 mm; designed for placement on high-density PCBs and compatible with carrier-tape automated mounting.
- Temperature & Lifetime — Rated for operation from −40°C to +85°C with an endurance specification of 2000 hours at 85°C under rated voltage.
- Reliability (AEC-Q200) — AEC-Q200 compliant, indicating suitability for applications that require component-level automotive qualification.
- Environmental Compliance — RoHS compliant (2011/65/EU, (EU)2015/863).
- Ripple Performance — Specified ripple currents of 62 mA at 120 Hz and 93 mA at 10 kHz to support common low- and high-frequency ripple conditions.
Typical Applications
- Automotive Electronics — Intended for use in automotive electronic modules where AEC-Q200 compliance is required.
- High-Density Surface-Mount PCBs — Designed for surface mounting on high-density boards in compact electronics assemblies.
- Automated Assembly — Applicable to automatic mounting machines fed with carrier tape for high-volume SMT production.
Unique Advantages
- AEC-Q200 Compliance: Provides component-level qualification for designs targeting automotive-grade reliability.
- Compact Chip Can: Small L: 5.4 × D: 8 mm package supports space-constrained PCB layouts while maintaining useful capacitance.
- Long Specified Load Life: Endurance rating of 2000 hours at 85°C under rated voltage gives designers predictable aging and life expectations.
- Tape-Feed Compatibility: Carrier-tape compatibility simplifies surface-mount pick-and-place and reduces assembly handling time.
- RoHS Conformant: Meets RoHS directives for restricted substances, facilitating regulatory compliance in end products.
- Broad Temperature Range: −40°C to +85°C operating range supports a variety of environmental conditions typical of automotive and industrial electronics.
Why Choose UWX1V330MCL1GB?
The UWX1V330MCL1GB combines a compact surface-mount chip can with electrical and environmental specifications tailored for automotive and high-density PCB applications. Its 33 µF, 35 V rating, specified ripple currents, and AEC-Q200 compliance make it a practical choice where component qualification and predictable lifetime under elevated temperature are required.
This part is well suited for designers working on automotive electronic modules or compact SMT assemblies that demand RoHS conformity, tape-feed assembly compatibility, and a clearly defined endurance profile. The combination of dimensional compactness and specified performance helps simplify board layout and assembly planning.
Request a quote or submit an inquiry for pricing, availability and lead-time details to proceed with evaluation or production planning for UWX1V330MCL1GB.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016