UWZ0J101MCL1GB

The UWZ0J101MCL1GB is a chip-type aluminum electrolytic capacitor from Nichicon’s UWZ series, offering 100 µF capacitance at a 6.3 V rating in a compact SMD can package. Engineered for broad temperature operation and high-temperature reflow compatibility, it targets automotive and other electronics designs that require robust performance, automated assembly, and long-term stability.

Key Features

• Core Type Chip-type aluminum electrolytic capacitor with polarized construction designed for surface-mount assembly.
• Electrical Performance 100 µF capacitance with ±20% tolerance; leakage current ≤ 0.01·C·V or 3 µA (whichever is greater) after 2 minutes at 20°C; tan δ (6.3 V) max 0.30 measured at 120 Hz, 20°C.
• Temperature Range & Endurance Rated for −55°C to +105°C operation with endurance specified as 1000 hours at 105°C. Capacitance change for rated voltages ≤16 V is within ±25% after endurance stress.
• High-temperature Reflow Compatibility Designed to withstand 260°C peak reflow soldering; recommended reflow condition is 260°C peak for 5 seconds, with 230°C maintained over 60 seconds, processed up to two times per the UWZ series guidance.
• Ripple Current Specified ripple handling of 60 mA at 120 Hz and 90 mA at 10 kHz.
• Package & Mounting Radial can – SMD package, compatible with carrier-tape feeding for automatic mounting machines; recommended PCB land size 6.6 × 6.6 mm.
• Compliance & Qualification RoHS compliant (2011/65/EU, (EU)2015/863) and AEC‑Q200 qualified.

Typical Applications

• Automotive electronic modules Suitable for electronic control units and modules that require components qualified to AEC‑Q200 and capable of wide operating temperature ranges.
• Surface-mount production Carrier-tape compatible SMD can package for automated assembly lines and reflow processes that reach 260°C.
• High-temperature environments Use where operation from −55°C to +105°C and extended 1000-hour endurance at 105°C are required.

Unique Advantages

• 260°C reflow-rated: Enables integration into lead-free, high-temperature reflow processes without sacrificing capacitor integrity.
• Wide operating temperature span: −55°C to +105°C supports designs exposed to harsh thermal conditions.
• AEC‑Q200 qualification: Meets automotive-grade qualification for use in vehicle electronic assemblies.
• Compact SMD can: 5.4 × 6.3 mm package footprint with a small recommended land pattern (6.6 × 6.6 mm) for space-constrained boards.
• Proven endurance: 1000 hours at 105°C with defined limits for capacitance change, tan δ and leakage current to help ensure long-term stability.
• Low leakage behavior: Leakage current limit of 0.01·C·V or 3 μA after initial application at 20°C supports low-loss designs.

Why Choose UWZ0J101MCL1GB?

The UWZ0J101MCL1GB combines Nichicon’s UWZ series specifications—high-temperature reflow tolerance, AEC‑Q200 qualification, and a wide −55°C to +105°C operating range—to provide a reliable surface-mount aluminum electrolytic solution for demanding electronic assemblies. Its compact SMD can form factor, carrier-tape compatibility, and defined endurance and leakage characteristics make it well suited for engineers specifying capacitors for automotive modules and other temperature-stressed, automated-production applications.

Designed for boards that require defined electrical behavior through thermal processing and extended high-temperature operation, this part offers clear, verifiable performance parameters for procurement and design validation.

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