UWZ0J221MCL1GS

The UWZ0J221MCL1GS is a chip-type aluminum electrolytic capacitor in the Nichicon UWZ series designed for surface-mount assembly. It delivers 220 µF at 6.3 V with polarized construction and is optimized for applications that require wide operating temperature range and high-temperature reflow compatibility.

This part targets automotive and other demanding electronics where AEC-Q200 qualification, RoHS compliance, and reliable performance across –55 °C to +105 °C are required. It is available in a compact 6.2 × 8 mm can-style SMD package suitable for automated mounting.

Key Features

• Electrical characteristics — 220 µF nominal capacitance, rated voltage 6.3 V, polarization, and capacitance tolerance ±20% (120 Hz, 20 °C).
• Wide temperature range — Specified operating range from –55 °C to +105 °C to support designs exposed to broad environmental conditions.
• High-temperature reflow compatibility — Designed to withstand 260 °C peak reflow soldering; recommended reflow condition: 260 °C peak 5 s, 230 °C over 60 s twice (φ8 × 6.2, φ10 × 10: once).
• Package and assembly — Chip-type SMD can (radial, can - SMD) with body dimensions L: 6.2 × D: 8 mm and recommended PCB land size 8.3 × 8.3 mm; applicable to automatic mounting machines fed with carrier tape.
• Reliability and endurance — Rated for 1000 hours at 105 °C per endurance specification in the datasheet.
• Performance specifics — Ripple current: 102 mA at 120 Hz and 153 mA at 10 kHz; leakage current after 2 minutes at 20 °C is not more than 0.01CV or 3 µA (whichever is greater); tan δ (max.) for 6.3 V is 0.30 (120 Hz, 20 °C).
• Qualification and compliance — AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronics — Intended for use in automotive systems where AEC-Q200 qualification and wide temperature capability are required.
• Automated surface-mount production — Suitable for designs assembled by automatic mounting machines fed with carrier tape and reflow soldering processes.
• High-reliability power modules — Applicable where endurance at elevated temperature (1000 h at 105 °C) and controlled leakage and loss characteristics are needed.

Unique Advantages

• AEC-Q200 qualification — Provides a recognized reliability baseline for automotive and other high-reliability applications.
• Wide operating temperature — –55 °C to +105 °C rating enables deployment across a broad range of environmental conditions.
• 260 °C reflow capable — Compatible with high-temperature reflow processes used in lead-free assembly, simplifying integration into modern manufacturing flows.
• Compact SMD can package — 6.2 × 8 mm footprint and carrier-tape compatible format support high-density, automated PCB assembly.
• Documented endurance — Specified 1000-hour performance at 105 °C gives designers a clear reliability metric for thermal stress scenarios.
• Measured performance data — Specified ripple currents, leakage current limit, and tan δ provide concrete electrical parameters for system-level power budgeting and filtering design.

Why Choose UWZ0J221MCL1GS?

The UWZ0J221MCL1GS combines the electrical capacity of a 220 µF aluminum electrolytic with a compact SMD can and package details tailored for automated assembly. Its AEC-Q200 qualification, RoHS compliance, wide temperature rating, and documented endurance at 105 °C make it appropriate for designers who need verifiable performance under thermal and environmental stress.

This part is well suited to engineers and procurement teams developing automotive-grade and high-reliability electronic modules that require consistent capacitance, controlled leakage, and compatibility with modern lead-free reflow processes.

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