UWZ0J470MCL1GB

The UWZ0J470MCL1GB from Nichicon is a surface-mount, chip-type aluminum electrolytic capacitor in the UWZ series. It provides 47 µF nominal capacitance at a rated voltage of 6.3 V with a compact φ5 × 5.4 mm can-style SMD package designed for automated assembly.

Designed for wide-temperature operation and robust end-of-life characteristics, this part targets electronics requiring stable bulk capacitance and reliable performance across −55°C to 105°C, including applications that demand AEC-Q200 qualification and RoHS compliance.

Key Features

• Capacitance & Voltage — 47 µF nominal capacitance with a rated voltage of 6.3 V and tolerance of −20% to +20%.
• Wide Temperature Range — Operating range from −55°C to 105°C to support designs exposed to extended ambient or thermal conditions.
• Endurance — Rated life of 1000 hours at 105°C, with specified limits for capacitance change, tan δ and leakage after test.
• Loss Angle (tan δ) — Maximum tan δ of 0.30 at 20°C, 120 Hz (rated for 6.3 V), providing defined dissipation characteristics for circuit design.
• Leakage Current — Low leakage current specified at 3 µA (measurement condition: after application of rated voltage at 20°C per datasheet criteria).
• Ripple Current — Low-frequency ripple current 36 mA at 120 Hz and high-frequency ripple current 54 mA at 10 kHz for decoupling and smoothing duties.
• Package & Mounting — Chip-type radial can for SMD, size φ5 × 5.4 mm, surface-mount land footprint 5.3 × 5.3 mm, supplied in embossed carrier taping for automatic placement.
• Standards & Compliance — AEC-Q200 qualified and RoHS compliant as specified in the product data.

Typical Applications

• Automotive electronics — Designed for use in vehicle electronic modules where AEC-Q200 qualification is required.
• Surface-mount power modules — Compact chip form factor and embossed carrier taping suit automated SMT assembly and tight-board designs.
• Wide-temperature systems — Bulk decoupling or energy storage in equipment operating across −55°C to 105°C.

Unique Advantages

• AEC-Q200 Qualification — Meets the AEC-Q200 standard listed in the product data, supporting use in qualifying automotive systems and other high-reliability designs.
• Wide operating temperature — −55°C to 105°C range provides design margin for assemblies exposed to harsh thermal environments.
• Reflow-capable chip package — Chip-type SMD in embossed carrier tape supports automated placement and reflow processes per UWZ series recommendations.
• Defined endurance rating — 1000 hours at 105°C with specified post-test limits helps predict long-term behavior in high-temperature applications.
• Low leakage and characterized dissipation — 3 µA leakage and specified tan δ (0.30 at 6.3 V, 120 Hz, 20°C) enable predictable performance in power and decoupling circuits.
• Compact footprint — φ5 × 5.4 mm can and 5.3 × 5.3 mm land size minimize board area while providing 47 µF capacitance.

Why Choose UWZ0J470MCL1GB?

The UWZ0J470MCL1GB delivers a balanced combination of capacitance, compact chip packaging, and defined reliability characteristics for designers who need a surface-mount aluminum electrolytic solution with AEC-Q200 recognition and extended temperature capability. Its documented ripple current, low leakage, and 1000-hour endurance at 105°C make it suitable where predictable long-term behavior is required.

This part is well suited to engineers specifying space-constrained power decoupling and bulk energy storage in assemblies that require automated placement, RoHS compliance, and qualification-level assurance from the component level.

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