UWZ0J681MCL1GS

The UWZ0J681MCL1GS is a chip‑type aluminum electrolytic capacitor from Nichicon’s UWZ series, designed for surface‑mount assembly and automated carrier‑tape placement. It provides 680 µF capacitance at a 6.3 V rating in a compact SMD can package and is polarized for typical electrolytic applications.

Engineered for demanding temperature and assembly environments, the device supports a wide operating temperature range (–55°C to +105°C), a 260°C peak reflow soldering profile, and is AEC‑Q200 qualified with RoHS compliance—making it suitable for automotive and other high‑reliability electronic assemblies.

Key Features

• Capacitance & Voltage: 680 µF rated capacitance at 6.3 V for bulk energy storage and smoothing in compact SMD form.
• Wide Temperature Range: Operates from –55°C to +105°C to support temperature‑variable environments.
• High‑temperature Reflow Compatibility: Corresponds with 260°C peak reflow soldering; recommended reflow condition is 260°C peak for 5 seconds (with specified profile repetitions).
• Automotive Qualification: AEC‑Q200 qualified and specified for automotive applications.
• Endurance: Rated for 1000 hours at 105°C with defined capacitance, tan δ and leakage current recovery criteria.
• Ripple Current Ratings: 210 mA at 120 Hz and 315 mA at 10 kHz for both low‑ and high‑frequency ripple performance.
• Surface‑Mount, Tape‑Feed Friendly: Chip‑type SMD can suited to automatic mounting machines fed with carrier tape; surface mount land size recommended at 8.3 × 8.3 mm.
• Regulatory Compliance: RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics: For use in automotive electronic assemblies where AEC‑Q200 qualification and wide temperature range are required.
• Automotive Assembly Lines: Compatible with automated placement and 260°C peak reflow processes used in modern PCB assembly.
• High‑Temperature Operating Environments: Suited to modules that must withstand extended exposure up to +105°C and meet 1000‑hour endurance requirements.

Unique Advantages

• High Capacitance in SMD Can: 680 µF at 6.3 V delivers substantial bulk capacitance while preserving board space through a chip‑type surface‑mount package.
• Assembly Process Compatibility: Qualified for 260°C peak reflow profiles and carrier‑tape mounting to streamline high‑temperature SMT production.
• Automotive‑Grade Reliability: AEC‑Q200 qualification and defined endurance (1000 h at 105°C) support use in safety‑ and reliability‑focused designs.
• Frequency Versatility: Specified ripple current performance at 120 Hz and 10 kHz supports both low‑frequency smoothing and higher‑frequency ripple environments.
• Regulatory Compliance: RoHS conformity reduces integration friction for regulated markets.
• Compact Footprint: Small can dimensions (L: 1 × D: 0.8 cm) with defined land pattern (8.3 × 8.3 mm) for predictable PCB layout and assembly.

Why Choose UWZ0J681MCL1GS?

The UWZ0J681MCL1GS positions itself as a robust surface‑mount electrolytic solution for automotive and other high‑reliability assemblies that require substantial capacitance, high‑temperature reflow compatibility, and defined endurance. Its combination of 680 µF capacitance at 6.3 V, AEC‑Q200 qualification, and wide operating temperature range makes it appropriate for designs needing durable bulk storage and ripple handling in compact SMD form.

For engineers and procurement teams building assemblies with automated placement and high‑temperature reflow processes, this Nichicon UWZ series part offers a verifiable performance profile, regulatory compliance, and documented endurance suitable for long‑term deployment in demanding environments.

Request a quote or submit an inquiry for pricing and lead‑time information to evaluate UWZ0J681MCL1GS for your next design.