UWZ1A151MCL1GS

The UWZ1A151MCL1GS is a surface‑mount aluminum electrolytic capacitor from Nichicon’s UWZ series, offering 150 µF capacitance at 10 V in a compact chip‑style can (φ6.3 × 5.8 mm). It is designed for automated assembly workflows with embossed carrier taping and compatibility with high‑temperature reflow processes.

Targeted for automotive applications, this part combines a wide operating temperature range (−55 °C to +105 °C), AEC‑Q200 qualification, and a 1000‑hour endurance rating at 105 °C to deliver reliable bulk capacitance in space‑constrained, high‑reliability designs.

Key Features

• Package & Mounting — Chip‑type radial can SMD in a compact φ6.3 × 5.8 mm footprint with embossed carrier taping for automatic mounting machines.
• Capacitance & Voltage — 150 µF nominal capacitance with a rated voltage of 10 V and tolerance of −20% to +20%.
• Wide Temperature Range — Specified to operate from −55 °C to +105 °C to suit demanding thermal environments.
• Reliability & Endurance — Rated for 1000 hours at 105 °C; endurance limits are defined for capacitance, tan δ and leakage after the life test.
• Loss Characteristic (tan δ) — tan δ = 0.24 measured at 20 °C, 120 Hz, providing a quantified dissipation factor for design evaluation.
• Ripple & Leakage — Low‑frequency ripple current 86 mA (120 Hz), high‑frequency ripple current 129 mA (10 kHz), and specified leakage current of 15 µA.
• Automotive Qualification — AEC‑Q200 listed rating for use in automotive applications.
• Reflow Compatibility — Chip type specified for 260 °C peak reflow, supporting standard high‑temperature soldering profiles used in automated assembly.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Automotive electronics — Provides bulk capacitance and smoothing in automotive systems requiring wide temperature operation and AEC‑Q200 qualification.
• Surface‑mount production — Embossed carrier taping and reflow compatibility enable high‑volume automated board assembly.
• Space‑constrained power modules — Compact φ6.3 × 5.8 mm can delivers 150 µF in a small footprint for dense board layouts.

Unique Advantages

• Compact high capacitance: 150 µF in a φ6.3 × 5.8 mm package allows designers to meet bulk capacitance needs without large board area.
• Wide operating temperature: −55 °C to +105 °C rating supports designs exposed to extreme thermal conditions.
• Automotive‑grade qualification: AEC‑Q200 listing supports use in automotive applications where qualification is required.
• Assembly‑friendly packaging: Embossed carrier taping and 260 °C reflow compatibility streamline automated manufacturing and reduce handling steps.
• Defined reliability metrics: 1000‑hour endurance at 105 °C and measured tan δ/leakage figures provide clear parameters for lifetime and performance budgeting.

Why Choose UWZ1A151MCL1GS?

UWZ1A151MCL1GS delivers a practical combination of high capacitance, compact packaging, and automotive‑grade reliability. Its chip‑type SMD can and embossed carrier taping simplify high‑volume assembly while the −55 °C to +105 °C range and 1000‑hour endurance rating at 105 °C make it suitable for demanding environments.

This part is appropriate for designers and procurement teams who need verified electrical characteristics (tan δ, ripple current, leakage) and qualification for automotive applications, packaged for reliable automated assembly and consistent production throughput.

Request a quote or submit an inquiry to receive pricing, lead‑time, and additional technical information for UWZ1A151MCL1GS. Our team can provide volume pricing and availability details to support your project timeline.