UWZ1A331MCL1GS

The UWZ1A331MCL1GS is a Nichicon UWZ-series aluminum electrolytic chip capacitor in a surface-mount radial can package. It delivers 330 µF at 10 V with a polarized design optimized for board-level power decoupling and energy storage in assemblies that require high-temperature reflow processing and wide operating temperature range.

Designed for automated production, this part supports carrier-tape feeding and is qualified to AEC-Q200. Key value propositions include compatibility with 260°C peak reflow, operation from −55°C to +105°C, and endurance characterized for automotive-grade environments.

Key Features

• Capacitance & Voltage: 330 µF nominal capacitance with a 10 V rated voltage and ±20% tolerance, suitable for board-level smoothing and bulk decoupling.
• Wide Temperature Range: Specified to operate from −55°C to +105°C, supporting designs exposed to broad thermal environments.
• High-Temperature Reflow Compatible: Corresponds with 260°C peak reflow soldering; recommended reflow condition: 260°C peak 5 s, 230°C over 60 s, 2 times (φ8 × 6.2, φ10 × 10: 1 time).
• Surface-Mount Radial Can (Chip Type): Chip type, radial can SMD package with surface mount land size 8.3 × 8.3 mm, compatible with automated placement from carrier tape.
• Reliability & Endurance: Rated for 1000 hours at 105°C; after endurance test, capacitance change remains within ±25% for 16 V or lower parts and leakage current meets specified limits.
• Leakage Current Specification: After 2 minutes at rated voltage and 20°C, leakage current is not more than 0.01CV or 3 µA, whichever is greater.
• Ripple Current: 195 mA at 120 Hz and 292.5 mA at 10 kHz, supporting filtering and transient handling across a range of frequencies.
• Compliance & Qualification: RoHS compliant and AEC-Q200 qualified for demanding applications; manufactured by Nichicon as part of the UWZ series.

Typical Applications

• Automotive electronic modules: Use in control units and electronic assemblies that require AEC-Q200 qualification and operation across −55°C to +105°C.
• Board-level power smoothing: Bulk decoupling and energy storage on PCBs assembled with high-temperature (260°C) reflow processes.
• High-temperature assembled surface-mount assemblies: Surface-mount radial can suited for automated placement from carrier tape and reflow processes common in industrial and vehicular manufacturing.
• Designs requiring long-term thermal endurance: Applications where 1000 hours at 105°C endurance and controlled leakage are important to system reliability.

Unique Advantages

• 260°C reflow compatibility: Enables use in assemblies that require peak 260°C soldering profiles without compromising capacitor characteristics.
• AEC-Q200 qualified: Provides a documented qualification path for applications demanding automotive-grade componentry.
• Wide operational temperature: −55°C to +105°C rating supports deployment across harsh thermal environments.
• High ripple capability: Specified ripple current at both low and high frequencies (195 mA at 120 Hz; 292.5 mA at 10 kHz) for reliable filtering and transient response.
• Manufacturing-ready packaging: Chip-type SMD in a radial can form factor compatible with carrier-tape feeding for automated placement.
• Endurance-proven performance: 1000-hour endurance at 105°C with defined limits on capacitance change and leakage current, supporting long-term reliability planning.

Why Choose UWZ1A331MCL1GS?

The UWZ1A331MCL1GS balances robust electrical performance with manufacturing compatibility for assemblies that undergo high-temperature reflow and operate across a wide temperature range. Its AEC-Q200 qualification and RoHS compliance make it suitable for demanding, regulated environments where long-term thermal endurance and controlled leakage are required.

This capacitor is a practical choice for design teams specifying a 330 µF, 10 V polarized surface-mount aluminum electrolytic solution from Nichicon’s UWZ series when automated assembly, reflow compatibility, and proven endurance are priorities.

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