UWZ1A330MCL1GB

The UWZ1A330MCL1GB is a chip‑type aluminum electrolytic capacitor in Nichicon’s UWZ series designed for surface‑mount production and long‑term operation across a wide temperature range. It combines a compact SMD can package with specifications targeted at applications that require reliable performance from −55°C to +105°C and endurance at elevated temperatures.

Key value propositions include AEC‑Q200 qualification for automotive use, compatibility with automated carrier‑tape mounting, and reflow capability up to a 260°C peak for modern SMT assembly processes.

Key Features

• Electrical Performance — 33 µF capacitance with 10 V rated voltage and ±20% tolerance (120 Hz, 20°C).
• Low Leakage — Leakage current after 2 minutes at 20°C is specified as not more than 0.01CV or 3 µA, whichever is greater.
• Loss Angle (tan δ) — tan δ at 120 Hz, 20°C for the 10 V rating is specified with a maximum of 0.24.
• Ripple Current — Rated ripple current of 35 mA at 120 Hz and 52.5 mA at 10 kHz.
• Thermal and Endurance — Operating temperature range from −55°C to +105°C with endurance of 1000 hours at 105°C.
• Reflow Compatibility — Corresponds with 260°C peak reflow soldering; recommended reflow condition is 260°C peak for 5 s (with specified profiles in the UWZ series guidance).
• Package & Mounting — Chip‑type radial can for SMD mounting; dimensions L: 5.4 × D: 5 mm and recommended land size L: 5.3 × W: 5.3 mm. Compatible with automatic mounting machines fed by carrier tape.
• Reliability & Compliance — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Suitable for automotive systems where AEC‑Q200 qualification and a −55°C to +105°C temperature range are required.
• Automated SMT Assembly — Designed for carrier‑tape feeding and high‑temperature reflow processes used in automated production lines.
• High‑Temperature Environments — Components and modules that require proven endurance at 105°C (1000 hours) benefit from the UWZ series construction and specifications.

Unique Advantages

• Automotive‑grade Reliability: AEC‑Q200 qualification provides documented suitability for automotive design flows.
• Wide Operating Temperature: −55°C to +105°C range supports designs that must operate across harsh thermal environments.
• 260°C Reflow Capability: Compatibility with a 260°C peak reflow profile enables integration into contemporary SMT assembly processes.
• Compact SMD Can Package: Small footprint (5.4 × 5 mm) and recommended land pattern (5.3 × 5.3 mm) simplify board layout for space‑constrained designs.
• Long‑Term Endurance: Specified for 1000 hours at 105°C, supporting designs that require sustained performance at elevated temperature.
• Measurable Performance Specs: Clear leakage, tan δ, and ripple current specifications enable straightforward electrical selection and validation.

Why Choose UWZ1A330MCL1GB?

The UWZ1A330MCL1GB delivers a focused combination of compact SMD packaging, wide temperature operation, and documented endurance that aligns with demanding production and in‑field requirements. With AEC‑Q200 qualification and RoHS compliance, it is positioned for use in applications where reliability, assembly compatibility, and thermal robustness are priorities.

This part is a fit for engineering and procurement teams building automotive and high‑temperature electronics that need clear electrical specifications (capacitance, leakage, tan δ, ripple current) and proven reflow and endurance characteristics backed by the UWZ series datasheet guidance.

If you would like pricing, availability, or a formal quote for the UWZ1A330MCL1GB, please request a quote or contact sales to discuss your volume and delivery needs.